Technical Committees
Technical Editors
Jason H. Anderson
University of Toronto, Toronto, Canada
Leonid Belostotski
The University of Calgary, Calgary, Canada
Dustin Dunwell
Alphawave IP, Toronto, Canada
Vincent Gaudet
University of Waterloo,Waterloo, Canada
Glenn Gulak
University of Toronto, Toronto, Canada
James W. Haslett
The University of Calgary, Calgary, Canada
Shahriar Mirabbasi
University of British Columbia, Vancouver, Canada
Multi-Media Coordinator and Digest Editor
David Halupka
StarIC, Toronto, Canada
Program Chair
Frank O’Mahony
intel, Hillsboro, OR
Program Vice-Chair
Thomas Burd
Advanced Micro Devices, Santa Clara, CA
ITPC European Regional Chair
Matteo Bassi
Infineon TechnologiesAG, Villach, Austria
ITPC European Regional Vice Chair
Viola Schaffer
Texas Instruments, Freising, Germany
ITPC Far East Regional Chair
Man-Kay Law
University of Macau, Taipa, Macau, China
ITPC Far East Regional Vice Chair
Jaehyouk Choi
KAIST, Daejeon, Korea
ITPC North America Regional Chair
Keith Bowman
Qualcomm, Raleigh, NC
ITPC North America Regional Vice-Chair
Jeff Walling
Virginia Tech, Blacksburg, VA
External Reviewers
Paul Whatmough (DAS)
Qualcomm, Cambridge, MA
Thierry Tambe (DAS)
Nvidia, Boston, MA
Analog Subcommittee
Chair: Maurits Ortmanns
Institute of Microelectronics, University of Ulm, Ulm, Germany
Ippei Akita
AIST, Tsukuba, Japan
Jens Anders
University of Stuttgart, Stuttgart, Germany
Marco Berkhout
Goodix Technology, Nijmegen, The Netherlands
Chinwuba Ezekwe
Robert Bosch, Sunnyvale, Ca
Qinwen Fan
Delft University of Technology, Delft, The Netherlands
Danielle Grifith
Texas Instruments, Dallas, TX
Drew Hall
University of California, San Diego, La Jolla, CA
Minkyu Je
KAIST, Yuseong-gu, Korea
Man-Kay Law
University of Macau, Macau, China
Viola Schafer
Texas Instruments, Freising, Germany
Shon-Hang Wen
MediaTek, Hsinchu City, Taiwan
Jiawei Xu
Fudan University, Shanghai, China
Data Converters Subcommittee
Chair: Jan Westra
Broadcom, Bunnik, The Netherlands
Lucien J. Breems
NXP Semiconductors, Eindhoven, The Netherlands
Ping Gui
Southern Methodist University, Dallas, TX
Benjamin Herschberg
Intel, Portland, OR
Jongwoo Lee
Samsung Electronics, Hwasung-si, Korea
Ying-Zu Lin
Mediatek, Hsinchu, Taiwan
Nima Maghari
University of Florida, Gainesville, FL
Shahrzad Naraghi
Legato Logic, San Jose, CA
Shanthi Pavan
IIT Madras Dept of Electrical Eng., Chennai, India
Hajime Shibata
Analog Devices, Toronto, Canada
Shiyu Su
University of Waterloo, Los Angeles, CA
Nan Sun
Tsinghua University, Beijing, China
Yan Zhu
University of Macau, Macau, China
Digital Architectures & Systems (DAS) Subcommittee
Chair: Rahul Rao
IBM India, Bangalore, India
Mark A. Anders
Intel, Hillsboro, OR
Shidhartha Das
Advanced Micro Devices, Cambridge, United Kingdom
Ji-Hoon Kim
Ewha Womans University, Seoul, Korea
Yongpan Liu
Tsinghua University, Beijing, China
Hugh Mair
MediaTek, Austin, TX
Sugako Otani
Renesas Electronics, Tokyo, Japan
Soojung Ryu
SAPEON Korea, Gyeonggi-do, Korea
Sophia Shao
UC Berkeley, Berkeley, CA
Rangharajan Venkatesan
NVIDIA Corporation, Santa Clara, CA
Chia-Hsiang Yang
National Taiwan University, Taipei, Taiwan
Digital Circuits (DCT) Subcommittee
Chair: Keith Bowman
Qualcomm, Raleigh, NC
Benton Calhoun
University of Virginia, Charlottesville, VA
Eric Jia-Wei Fang
Mediatek, Hsinchu City, Taiwan
Kazuki Fukuoka
Renesas Electronics, Tokyo, Japan
Tanay Karnik
Intel, Hillsboro, OR
Huichu Liu
Meta Agile Silicon Team, Menlo Park, CA
Jun-Seok Park
S.LSI, Samsung Electronics, Gyeonggi-do, Korea
Arijit Raychowdhury
Georgia Institute of Technology, Atlanta, GA
Akihide Sai
Toshiba IoT Edge Laboratory, Research and Development Center, Kawasaki, Japan
Visvesh Sathe
Georgia Institute of Technology, Atlanta, GA
Jae-sun Seo
Arizona State University, Tempe, AZ
Yvain Thonnart
CEA-Leti, Grenoble, France
Heein Yoon
Ulsan National Institute of Science and Technology, Ulsan, Korea
IMMD Subcommittee
Chair: Rikky Muller
University of California Berkeley, Berkeley, CA
Jun-Chau Chien
National Taiwan University, Taipei, Taiwan
Leonardo Gasparini
Fondazione Bruno Kessler, Povo, Italy
Sohmyung Ha
New York University, New York, NY
Mutsumi Hamaguchi
Sharp Corporation, Tenri City, Japan
Taekwang Jang
ETH Zurich, Zurich, Switzerland
Mehdi Kiani
Pennsylvania State University, State College, PA
Seong-Jin Kim
Ulsan National Institute of Science and Technology, Ulsan, Korea
Junghyup Lee
DGIST, Daegu, Korea
Carolina Mora-Lopez
Imec, Leuven, Belgium
Masaki Sakakibara
Sony Semiconductor Solutions Corporation, Kanagawa, Japan
Sanshiro Shishido
Panasonic Holdings Corporation, Osaka, Japan
Mahsa Shoaran
EPFL, Geneva, Switzerland
Andreas Suess
OMNIVISION Technologies, Santa Clara, CA
Kea-Tiong (Samuel) Tang
National Tsing Hua Univ., Hsinchu, Taiwan
Johan Vanderhaegen
Google, Mountain View, CA
Augusto Ximenes
Meta Platforms, Redmond, WA
Jerald Yoo
National University of Singapore, Singapore
Memory Subcommittee
Chair: Meng-Fan Chang
National Tsing Hua University, Hsinchu, Taiwan
Ankur Agrawal
IBM T. J. Watson Research Center, Yorktown Heights, NY
Juang-Ying Chueh
Etron Technology, Taipei, Taiwan
Takashi Ito
Renesas, Tokyo, Japan
Eric Karl
Intel, Portland, OR
Dongkyun Kim
SK hynix, Gyeonggi-do, Korea
Hye-Ran Kim
Samsung Electronics, Gyeonggi-do, Korea
Kyu-Hyoun (KH) Kim
IBM T.J. Watson, Yorktown Heights, NY
Seung-Jae Lee
Samsung, Gyeonggi-do, Korea
Ming Liu
Fudan University, Shanghai, China
Violante Moschiano
Intel, Rome, Italy
Hidehiro Shiga
KIOXIA, Yokohama, Japan
Eric Wang
TSMC, Hsinchu, Taiwan
John Wuu
Advanced Micro Devices, Fort Collins, CO
Jun Yang
Southeast University, Nanjing, China
Power Management Subcommittee
Chair: Bernhard Wicht
University of Hannover, Hannover, Germany
Patrik Arno
ST Microelectronics, Grenoble, France
Saurav Bandyopadhyay
Texas Instruments, Dallas, TX
Ke-Horng Chen
National Yang Ming Chiao Tung University, Hsinchu, Taiwan
Lin Cheng
University of Science and Technology of China, Anhui, China
Shusuke Kawai
Wireless System Laboratory Corporate Research & Development Center Toshiba Corporation, Kawasaki, Japan
Xugang Ke
Zhejiang University, Hangzhou, China
Dongsu Kim
Samsung Electronics, Gyeonggi-do, Korea
Hyun-Sik Kim
School of Electrical Engineering KAIST, Daejeon, Korea
Harish Krishnamurthy
Intel, Hillsboro, OR
Hanh-Phuc Le
University of California San Diego, La Jolla, CA
Xun Liu
The Chinese University of Hong Kong, Shenzhen, Hong Kong
Yan Lu
University of Macau, Taipa, Macao
Kousuke Miyaji
Shinshu University, Nagano, Japan
Jiseon Paek
Pusan National University, Pusan, Korea
John Pigott
NXP Semiconductors, Chandler, AZ
Gael Pillonnet
CEA-Leti, Grenoble, France
Frank Pramassing
Infineon Technologies Austria AG, Villach, Austria
Xin Zhang
IBM T. J. Watson Research Center, Yorktown Heights, NY
RF Subcommittee
Chair: Brian Ginsburg
Texas Instruments, Dallas, TX
Masoud Babaie
Delft University of Technology, Zuid-Holland, The Netherlands
Yves Baeyens
Nokia – Bell Labs, Murray Hill, NJ
Dmytro Cherniak
Infineon Technologies, Villach, Austria
Jaehyouk Choi
KAIST, Daejeon, Korea
Wei Deng
Tsinghua University, Beijing, China
Jeremy Dunworth
Qualcomm Technologies, San Diego, CA
Hiroshi Hamada
NTT DOCOMO, Kanagawa, Japan
Ruonan Han
Massachusetts Institute of Technology, Cambridge, MA
Mona Hella
Rensselaer Polytechnic Institute, Troy, NY
Yu-Li Hsueh
Mediatek Inc, Hsinchu, Tiawan
Salvatore Levantino
Politecnico di Milano, Milano, Italy
Xun Luo
University of Electronic Science and Technology of China, Chengdu, China
Swaminathan Sankaran
Texas Instruments, Dallas, TX
Henrik Sjöland
Lund University, Ericsson Research Dept. of Electrical and Information Technology, Lund, Sweden
Jeff Walling
Virginia Tech Electrical & Computer Engineering, Blacksburg, VA
Wanghua Wu
Samsung Semiconductor, San Jose, CA
Hongtao Xu
Fudan University, Shanghai, China
Jun Yin
University of Macau, Taipa, Macau, China
Security Subcommittee
Chair: Ingrid Verbauwhede
KU Leuven, Leuven, Belgium
Utsav Banerjee
Indian Institute of Science, Karnataka, India
Chiraag Juvekar
Apple, San Carlos, CA
Yong Ki Lee
Samsung Electronics, Gyeonggi-do, Korea
Sanu Mathew
Intel, Hillsboro, OR
Thomas Poeppelmann
Infineon Technologies, Bavaria, Germany
Shreyas Sen
Purdue University, West Lafayette, IN
Takeshi Sugawara
The University of Electro-Communications Chofugaoka, Tokyo, Japan
Technology Directions Subcommittee
Chair: Ali Hajimiri
Caltech, Pasadena, CA
Firooz Aflatouni
University of Pennsylvania, Philadelphia, PA
Joseph Bardin
Google & UMass Amherst, Goleta, CA
Denis Daly
Apple, Wellesley, MA
Giorgio Ferrari
Politecnico di Milano, Milano, Italy
Shawn Shuo-Hung Hsu
National Tsing Hua University, Hsinchu, Taiwan
Kyeongha Kwon
KAIST, Daejeon, Korea
Noriyuki Miura
Osaka University, Osaka, Japan
Alyosha Molnar
Cornell University, Ithaca, NY
Daniel H. Morris
Meta, Sunnyvale, CA
Fabio Sebastiano
Delft University of Technology, Delft, The Netherlands
Kaushik Sengupta
Princeton University, Princeton, NJ
Sudip Shekhar
University of British Columbia, Vancouver, Canada
Guy Torfs
Ghent University, Ghent, Belgium
Rabia Tugce Yazicigil
Boston University, Boston, MA
Milin Zhang
Tsinghua University, Beijing, China
Wireless Subcommittee
Chair: Chih-Ming Hung
MediaTek, Taipei, Taiwan
Matteo Bassi
Infineon Technologies AG, Villach, Austria
Venumadhav Bhagavatula
Samsung Semiconductor, San Jose, CA
Wu-Hsin Chen
Qualcomm, San Diego, CA
Vito Giannini
Uhnder, Austin, TX
Giuseppe Gramegna
imec, Leuven, Belgium
Jane Gu
University of California Davis, Davis, CA
Renzhi Liu
Intel, Hillsboro, OR
Byung-Wook Min
Yonsei University, Seoul, Korea
Jan Prummel
Renesas Design Netherlands ‘s-Hertogenbosch, The Netherlands
Negar Reiskarimia
Massachusetts Institute of Technology (MIT), Cambridge, MA
Bodhisatwa Sadhu
IBM T. J. Watson Research Center, Yorktown Heights, NY
Shahriar Shahramian
Nokia – Bell Labs, New Providence, NJ
Ho-Jin Song
Pohang University of Science and Technology, Gyeongbuk, Korea
David Wentzlof
University of Michigan, Everactive, Ann Arbor, MI
Yun Yin
Fudan University, Shanghai, China
Yuanjin Zheng
Nanyang Technological University
Alireza Zolfaghari
Broadcom, Irvine, CA
Wireline Subcommittee
Chair: Thomas Toifl
Cisco Systems, Thalwil, Switzerland
Tamer Ali
Mediatek, Irvine, CA
Wei-Zen Chen
National Yang Ming Chiao Tung University, Hsinchu, Taiwan
Zeynep Deniz
IBM, Woodbridge, CT
Masum Hossain
Carleton University Department of Electronics, Ottawa, Canada
Kenny Hsieh
TSMC, Hsinchu, Taiwan
Jay Im
AMD, San Jose, CA
Mozhgan Mansuri
Intel, Hillsboro, OR
Didem Turker Melek
Cadence Design Systems, San Jose, CA
Peter Ossieur
Imec, Univ. Ghent, Ghent, Belgium
Ben Rhew
Samsung, Gyeonggi-do, Korea