VIDEO ARCHIVE: 2015 Demo Sessions

The Academic and Industrial Demonstration Sessions featured live demonstrations of selected ICs that were also presented by authors in regular paper sessions. These sessions are intended to exemplify the real-life applications made possible by new ICs presented at ISSCC.

 

2015 IDS 4.4

4.4: Energy-Efficient Microserver Based on a 12-Core 1.8GHz 188K-CoreMark 28nm Bulk CMOS 64b SoC for Big-Data Applications with 159GB/s/L Memory Bandwidth System Density

Ronald Luijten1, Dac Pham2, Rolf Clauberg1, Matteo Cossale1, Huy N. Nguyen2, Mihir Pandya2
1 IBM Research, Rüschlikon, Switzerland
2 Freescale Semiconductor, Austin, TX

 

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2015 IDS 4.5

4.5: The Xeon® Processor E5-2600 v3: A 22nm 18-Core Product Family

Bill Bowhill1, Blaine Stackhouse2, Nevine Nassif1, Zibing Yang1, Arvind Raghavan1, Charles Morganti2, Chris Houghton1, Dan Krueger2, Olivier Franza1, Jayen Desai2, Jason Crop2, Dave Bradley2, Chris Bostak2, Sal Bhimji1, Matt Becker1
1 Intel, Hudson, MA
2 Intel, Fort Collins, CO

 

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2015 IDS 4.8

4.8: A 28nm x86 APU Optimized for Power and Area Efficiency

Kathryn Wilcox1, David Akeson1, Harry R. Fair III1, Jim Farrell1, Dave Johnson2, Guhan Krishnan1, Hugh McIntyre3, Edward McLellan1, Samuel Naffziger2, Russell Schreiber4, Sriram Sundaram4, Jonathan White1
1 AMD, Boxborough, MA
2 AMD, Fort Collins, CO
3 AMD, Sunnyvale, CA
4 AMD, Austin, TX

 

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2015 IDS 6.6

6.6: A 240Hz-Reporting-Rate Mutual-Capacitance Touch-Sensing Analog Front-End Enabling Multiple Active/Passive Styluses with 41dB/32dB SNR for 0.5mm Diameter

Mutsumi Hamaguchi, Michiaki Takeda, Masayuki Miyamoto
SHARP, Tenri, Japan

 

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2015 IDS 8.2

8.2: Batteryless Sub-nW Cortex-M0+ Processor with Dynamic Leakage-Suppression Logic

Wootaek Lim, Inhee Lee, Dennis Sylvester, David Blaauw
University of Michigan, Ann Arbor, MI

 

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2015 IDS 9.7

9.7: An LTE SAW-Less Transmitter Using 33% Duty-Cycle LO Signals for Harmonic Suppression

Yen-Horng Chen1, Neric Fong2, Bing Xu3, Caiyi Wang3
1 MediaTek, Hsinchu, Taiwan
2 MediaTek, San Jose, CA
3 MediaTek, Austin, TX

 

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2015 IDS 10.1

10.1: A 6Gb/s 6pJ/b 5mm-Distance Non-Contact Interface for Modular Smartphones Using Two-Fold Transmission-Line Coupler and EMC-Qualified Pulse Transceiver

Atsutake Kosuge, Shu Ishizuka, Junichiro Kadomoto, Tadahiro Kuroda
Keio University, Yokohama, Japan

 

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2015 IDS 10.2

10.2: An FSK Plastic Waveguide Communication Link in 40nm CMOS

Wouter Volkaerts, Niels Van Thienen, Patrick Reynaert
KU Leuven, Leuven, Belgium

 

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2015 IDS 10.3

10.3: A 7.5mW 7.5Gb/s Mixed NRZ/Multi-Tone Serial-Data Transceiver for Multi-Drop Memory Interfaces in 40nm CMOS

Kiarash Gharibdoust1, Armin Tajalli1,2, Yusuf Leblebici1
1 EPFL, Lausanne, Switzerland
2 Kandou Bus, Lausanne, Switzerland

 

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2015 IDS 11.1

11.1: A Time-Divided Spread-Spectrum Code Based 15pW-Detectable Multi-Channel fNIRS IC for Portable Functional Brain Imaging

Jong-Kwan Choi, Jae-Myoung Kim, Gunpil Hwang, Jaehyeok Yang, Min-Gyu Choi, Hyeon-Min Bae
KAIST, Daejeon, Korea

 

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2015 IDS 11.3

11.3: A 160×120-Pixel Analog-Counting Single-Photon Imager With Sub-ns Time-Gating and Self-Referenced Column-Parallel A/D Conversion for Fluorescence Lifetime Imaging

Matteo Perenzoni, Nicola Massari, Daniele Perenzoni, Leonardo Gasparini, David Stoppa
Fondazione Bruno Kessler, Povo, Italy

 

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2015 IDS 11.8

11.8: Integrated Ultrasonic System for Measuring Body-Fat Composition

Hao-Yen Tang1, Yipeng Lu2, Stephanie Fung2, David A. Horsley2, Bernhard E. Boser1
1 University of California, Berkeley, CA
2 University of California, Davis, CA

 

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2015 IDS 12.6

12.6: 90% Peak Efficiency Single-Inductor-Multiple-Output DC-DC Buck Converter with Output Independent Gate Drive Control

Yi-Ping Su1, Chiun-He Lin1, Shen-Yu Peng1, Ru-Yu Huang1, Te-Fu Yang1, Shin-Hao Chen1, Ting-Jung Lo1, Ke-Horng Chen1, Chin-Long Wey1, Ying-Hsi Lin2, Chao-Cheng Lee2, Jian-Ru Lin2, Tsung-Yen Tsai2
1 National Chiao Tung University, Hsinchu, Taiwan
2 Realtek Semiconductor, Hsinchu, Taiwan

 

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2015 IDS 13.2

13.2: A 3.7mW-RX 4.4mW-TX Fully Integrated Bluetooth Low-Energy/IEEE802.15.4/Proprietary SoC with an ADPLL-Based Fast Frequency Offset Compensation in 40nm CMOS

Yao-Hong Liu1, Christian Bachmann1, Xiaoyan Wang1, Yan Zhang1, Ao Ba1, Benjamin Busze1, Ming Ding1, Pieter Harpe2, Gert-Jan van Schaik1, Georgios Selimis1, Hans Giesen1, Jordy Gloudemans1, Adnane Sbai1, Li Huang1, Hiromu Kato3, Guido Dolmans1, Kathleen Philips1, Harmke de Groot1
1 Holst Centre / imec, Eindhoven, The Netherlands
2 Eindhoven University of Technology, Eindhoven, The Netherlands
3 Renesas Electronics, Kawasaki, Japan

 

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2015 IDS 13.3

13.3: A 10mW Bluetooth Low-Energy Transceiver with On-Chip Matching

Jan Prummel, Michail Papamichail, Michele Ancis, John Willms, Rahul Todi, William Aartsen, Wim Kruiskamp, Johan Haanstra, Enno Opbroek, Søren Rievers, Peter Seesink, Harrie Woering, Chris Smit
Dialog Semiconductor, 's-Hertogenbosch, The Netherlands

 

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2015 IDS 13.7

13.7: A +10dBm 2.4GHz Transmitter with sub-400pW Leakage and 43.7% System Efficiency

Arun Paidimarri, Nathan Ickes, Anantha P. Chandrakasan
Massachusetts Institute of Technology, Cambridge, MA

 

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2015 IDS 16.3

16.3: Flexible Thin-Film NFC Tags Powered by Commercial USB Reader Device at 13.56MHz

Kris Myny1, Brian Cobb2, Jan-Laurens van der Steen2, Ashutosh K. Tripathi2, Jan Genoe1,3, Gerwin Gelinck2, Paul Heremans1,3
1 imec, Heverlee, Belgium
2 Holst Centre / TNO, Eindhoven, The Netherlands
3 KU Leuven, Leuven, Belgium

 

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2015 IDS 16.5

16.5: A NEMS-Array Control IC for Sub-Attogram Gravimetric Sensing Applications in 28nm CMOS Technology

Nicolas Delorme1, Christophe Le Blanc1, Alessandro Dezzani1, Mickaël Bely1, Alexandre Ferret1, Simon Laminette1, Jérôme Roudier1, Eric Colinet2
1 Asygn, Grenoble, France
2 Apix Analytics, Grenoble, France

 

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2015 IDS 16.6

16.6: A Double-Side CMOS-CNT Biosensor Array with Padless Structure for Simple Bare-Die Measurements in a Medical Environment

Jinhong Ahn1, Jeaheung Lim1, Seok-Hyang Kim1, Jun-Yeon Yun1, Changhyun Kim1, Sang-Hoon Hong2, Myoung-Jin Lee3, Youngjune Park1
1 Seoul National University, Seoul, Korea
2 Kyung Hee University, Yongin, Korea
3 Chonnam National University, Gwangju, Korea

 

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2015 IDS 18.1

18.1: A 2.71nJ/Pixel 3D-Stacked Gaze-Activated Object-Recognition System for Low-Power Mobile HMD Applications

Injoon Hong, Kyeongryeol Bong, Dongjoo Shin, Seongwook Park, Kyuho Lee, Youchang Kim, Hoi-Jun Yoo
KAIST, Daejeon, Korea

 

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2015 IDS 18.6

18.6: A 0.5nJ/Pixel 4K H.265/HEVC Codec LSI for Multi-Format Smartphone Applications

Chi-Cheng Ju, Tsu-Ming Liu, Kun-Bin Lee, Yung-Chang Chang, Han-Liang Chou, Chih-Ming Wang, Tung-Hsing Wu, Hue-Min Lin, Yi-Hsin Huang, Chia-Yun Cheng, Ting-An Lin, Chun-Chia Chen, Yu-Kun Lin, Min-Hao Chiu, Wei-Cing Li, Sheng-Jen Wang, Yen-Chieh Lai, Ping Chao, Chih-Da Chien, Meng-Jye Hu, Peng-Hao Wang, Fu-Chun Yeh, Yen-Chao Huang, Shun-Hsiang Chuang, Lien-Fei Chen, Hsiu-Yi Lin, Ming-Long Wu, Che-Hong Chen, Ryan Chen, HY Hsu, Kevin Jou
MediaTek, Hsinchu, Taiwan

 

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2015 IDS 19.4

19.4: A 2.7-to-3.7GHz Rapid Interferer Detector Exploiting Compressed Sampling with a Quadrature Analog-toInformation Converter

Rabia Tugce Yazicigil1, Tanbir Haque1,2, Michael R. Whalen1, Jeffrey Yuan1, John Wright1, Peter R. Kinget1
1 Columbia University, New York, NY
2 InterDigital Communications, Melville, NY

 

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2015 IDS 20.6

20.6: Electromagnetic Vibration Energy Harvester Interface IC with Conduction-Angle-Controlled Maximum-Power-Point Tracking and Harvesting Efficiencies of up to 90%

Joachim Leicht1, Mohammad Amayreh1, Christian Moranz1, Dominic Maurath1, Thorsten Hehn2, Yiannos Manoli1,2
1 University of Freiburg - IMTEK, Freiburg, Germany
2 HSG-IMIT, Villingen-Schwenningen, Germany

 

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2015 IDS 20.8

20.8: A 500nW Batteryless Integrated Electrostatic Energy Harvester Interface Based on a DC-DC Converter with 60V Maximum Input Voltage and Operating From 1µW Available Power, Including MPPT and Cold Start

Stefano Stanzione1, Chris van Liempd1, Misato Nabeto2, Firat Refet Yazicioglu3, Chris Van Hoof1,4
1 Holst Centre / imec, Eindhoven, The Netherlands
2 OMRON, Kizugawa, Japan
3 imec, Heverlee, Belgium
4 KU Leuven, Leuven, Belgium

 

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2015 IDS 21.4

21.4: A Microfluidic-CMOS Platform with 3D Capacitive Sensor and Fully Integrated Transceiver IC for Palmtop Dielectric Spectroscopy

Mehran Bakhshiani, Michael A. Suster, Pedram Mohseni
Case Western Reserve University, Cleveland, OH

 

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2015 IDS 22.2

22.2: A 25Gb/s Hybrid Integrated Silicon Photonic Transceiver in 28nm CMOS and SOI

Yanfei Chen1, Masaya Kibune1, Asako Toda5, Akinori Hayakawa1,3,4, Tomoyuki Akiyama1,3,4, Shigeaki Sekiguchi1,3,4, Hiroji Ebe1,3,4, Nobuhiro Imaizumi1, Tomoyuki Akahoshi1, Suguru Akiyama3, Shinsuke Tanaka3, Takasi Simoyama3, Ken Morito1,3,4, Takuji Yamamoto2, Toshihiko Mori1, Yoichi Koyanagi1, Hirotaka Tamura1
1 Fujitsu Laboratories, Kawasaki, Japan
2 Fujitsu Laboratories of America, Sunnyvale, CA
3 Photonics Electronics Technology Research Association, Tsukuba, Japan
4 Fujitsu Limited, Kawasaki, Japan
5 contributed to this work while employed by Fujitsu Laboratories of America, Sunnyvale, CA

 

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2015 IDS 24.2

24.2: Context-Aware Hierarchical Information-Sensing in a 6µW 90nm CMOS Voice Activity Detector

Komail Badami, Steven Lauwereins, Wannes Meert, Marian Verhelst
KU Leuven, Leuven, Belgium

 

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2015 IDS 27.3

27.3: A 3-Axis Open-Loop Gyroscope with Demodulation Phase Error Correction

Chinwuba D. Ezekwe1, Wolfram Geiger2, Torsten Ohms3
1 Robert Bosch, Palo Alto, CA
2 Robert Bosch, Reutlingen, Germany
3 Bosch Sensortec, Reutlingen, Germany

 

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2015 IDS 27.8

27.8: A 4600µm2 1.5°C (3s) 0.9kS/s Thermal-Diffusivity Temperature Sensor with VCO-Based Readout

Rui Quan, Ugur Sonmez, Fabio Sebastiano, Kofi A. A. Makinwa
Delft University of Technology, Delft, The Netherlands

 

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2014 Demo Session Videos

Announcements

2017 Advance Registration is closed. On-line registration at on-site rates will open on February 1, 2017

Make your reservation now at the San Francisco Marriott Marquis to get the ISSCC group rate.

2017 Paper Submissions CLOSED

 


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