VIDEO ARCHIVE: 2014 Demo Sessions

The Academic and Industrial Demonstration Sessions featured live demonstrations of selected ICs that were also presented by authors in regular paper sessions. These sessions are intended to exemplify the real-life applications made possible by new ICs presented at ISSCC.

 

2014 IDS 1.3

1.3: How Chips Pave the Road to the Higgs Particle and the Attoworld Beyond

Erik H. M. Heijne
Instrumentation Physicist, CERN PH Department, Geneva, Switzerland
also with IEAP Czech Technical University Prague & Nikhef Amsterdam

 

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2014 IDS 5.9 and 13.1

5.9 and 13.1: Haswell: A Family of IA 22nm Processors & A 1Gb 2GHz Embedded DRAM in 22nm Tri-Gate CMOS Technology

C. Honl, D. Sutherland, F. Hamzaoglu, N. Kurd, M. Chowdhury, E. Burton, T.P. Thomas, C. Mozak, B. Boswell, M. Lal, A. Deval, J. Douglas, M. Elassal, A. Nalamalpu, T.M., Wilson, M. Merten, S. Chennupaty, W. Gomes, R. Kumar, U. Arslan, N. Bisnik, S. Ghosh, M. B. Lal, N. Lindert, M. Meterelliyoz, R.B. Osborne, J. Park, S. Tomishima, Y. Wang, K. Zhang
Intel, Hillsboro, OR

 

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2014 IDS 7.6

7.6: A 512×424 CMOS 3D Time-of-Flight Image Sensor with Multi-Frequency Photo-Demodulation up to 130MHz and 2GS/s ADC

Andrew Payne, Andy Daniel, Anik Mehta, Barry Thompson, Cyrus S. Bamji, Dane Snow, Hideaki Oshima, Larry Prather, Mike Fenton, Lou Kordus, Pat O’Connor, Rich McCauley, Sheethal Nayak, Sunil Acharya, Swati Mehta, Tamer Elkhatib, Thomas Meyer, Tod O’Dwyer, Travis Perry, Vei-Han Chan, Vincent Wong, Vishali Mogallapu, William Qian, Zhanping Xu
Microsoft, Mountain View, CA

 

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2014 IDS 8.2

8.2: A 12×5 Two-Dimensional Optical I/O Array for 600Gb/s Chip-to-Chip Interconnect in 65nm CMOS

Hiroshi Morita, Koki Uchino, Eiji Otani, Hiizu Ohtorii, Takeshi Ogura, Kazunao Oniki, Shuichi Oka, Shusaku Yanagawa, Hideyuki Suzuki
Sony, Tokyo, Japan

 

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2014 IDS 9.7

9.7: A 0.33nJ/b IEEE802.15.6/Proprietary-MICS/ISM-Band Transceiver with Scalable Data-Rate from 11kb/s to 4.5Mb/s for Medical Applications

Maja Vidojkovic1, Xiongchuan Huang1, Xiaoyan Wang1, Cui Zhou1, Ao Ba1, Maarten Lont1, Yao-Hong Liu1, Pieter Harpe2, Ming Ding1, Ben Busze1, Nauman Kiyani1, Kouichi Kanda3, Shoichi Masui3, Kathleen Philips1, Harmke de Groot1
1 Holst Centre/imec, Eindhoven, The Netherlands
2 Eindhoven University of Technology, Eindhoven, The Netherlands
3 Fujitsu Laboratories, Kawasaki, Japan

 

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2014 IDS 18.3 and 10.6

10.6 and 18.3: A 0.74V 200W Multi-Standard Transceiver Digital Baseband in 40nm LP-CMOS for 2.4GHz Bluetooth Smart / ZigBee / IEEE 802.15.6 Personal Area Networks & A Multi-Parameter Signal-Acquisition SoC for Connected Personal Health Applications

C. Bachmann2, G. van Schaik2, B. Busze2, M. Konijnenburg2, Y. Zhang2, J. Stuyt2, M. Ashouei2, G. Dolmans2, T. Gemmeke2, H. de Groot2, N. Van Helleputte2, M. Konijnenburg2, H. Kim1, J. Pettine1, D.W. Jee1, A. Breeschoten2, A. Morgado1, T. Torfs1, R. F. Yazicioglu1, C. Van Hoof1
1 imec, Leuven, Belgium
2 Holst Centre/imec, Eindhoven, The Netherlands

 

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2014 IDS 11.3

11.3: A 10b 0.6nW SAR ADC with Data-Dependent Energy Savings Using LSB-First Successive Approximation

Frank M. Yaul, Anantha P. Chandrakasan
Massachusetts Institute of Technology, Cambridge, MA

 

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2014 IDS 12.1

12.1: 3D Ultrasonic Gesture Recognition

Richard J. Przybyla1, Hao-Yen Tang1, Stefon E. Shelton2, David A. Horsley2, Bernhard E. Boser1
1 University of California, Berkeley, CA
2 University of California, Davis, CA

 

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2014 IDS 12.3

12.3: A 240Hz-Reporting-Rate 143×81 Mutual-Capacitance Touch-Sensing Analog Front-End IC with 37dB SNR for 1mm-Diameter Stylus

Mutsumi Hamaguchi1, Akira Nagao2, Masayuki Miyamoto2
1 Sharp, Fukuyama, Japan
2 Sharp, Tenri, Japan

 

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2014 IDS 12.4

12.4: A 1mm-Pitch 80×80-Channel 322Hz-Frame-Rate Touch Sensor with Two-Step Dual-Mode Capacitance Scan

Noriyuki Miura1, Shiro Dosho2, Satoshi Takaya1, Daisuke Fujimoto1, Takumi Kiriyama1, Hiroyuki Tezuka2, Takuji Miki2, Hiroto Yanagawa2, Makoto Nagata1
1 Kobe University, Kobe, Japan
2 Panasonic, Osaka, Japan

 

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2014 IDS 12.8

12.8: A BJT-Based CMOS Temperature Sensor with a 3.6pJK2-Resolution FoM

Ali Heidary1,2,3, Guijie Wang1,2, Kofi Makinwa2, Gerard Meijer1,2,4
1 Smartec, Breda, The Netherlands
2 Delft University of Technology, Delft, The Netherlands
3 Guilan University, Rasht, Iran
4 SensArt, Delft, The Netherlands

 

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2014 IDS 14.5

14.5: A 0.53THz Reconfigurable Source Array with up to 1mW Radiated Power for Terahertz Imaging Applications in 0.13µm SiGe BiCMOS

Ullrich R Pfeiffer1, Yan Zhao1, Janusz Grzyb1, Richard Al Hadi1, Neelanjan Sarmah1, Wolfgang Förster1, Holger Rücker2, Bernd Heinemann2
1 University of Wuppertal, Wuppertal, Germany
2 IHP, Frankfurt (Oder), Germany

 

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2014 IDS 16.1 and 5.7

16.1: A 340mV-to-0.9V 20.2Tb/s Source-Synchronous Hybrid Packet/Circuit-Switched 1616 Network-on-Chip in 22nm Tri-Gate CMOS

G. Chen, C. Tokunaga, M. A. Anders, J. Ryan, H. Kaul, C. Augustine, S. K. Satpathy, J. Kulkarni, S. K. Mathew, Y.C. Shih, S. K. Hsu, S. Kim, A. Agarwal, R. Jain, K. Bowman, A. Raychowdhury, M. Khellah, R.K. Krishnamurthy, J. Tschanz, S. Borkar, V. De
Intel, Hillsboro, OR

 

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2014 IDS 17.4

17.4: CMOS Impedance Analyzer for Nanosamples Investigation Operating up to 150MHz with Sub-aF Resolution

Giorgio Ferrari, Davide Bianchi, Angelo Rottigni, Marco Sampietro
Politecnico di Milano, Milan, Italy

 

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2014 IDS 18.1

18.1: A 1V 3mA 2.4GHz Wireless Digital Audio Communication SoC for Hearing-Aid Applications in 0.18µm CMOS

Amre El-Hoiydi1, François Callias1, Yves Oesch1, Christoph Kuratli2, Robert Kvacek3
1 Phonak Communications, Murten, Switzerland
2 EM Microelectronic, Marin, Switzerland
3 ASICentrum, Prague, Czech Republic

 

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2014 IDS 20.5

20.5: A 40nm Dual-Band 3-Stream 802.11a/b/g/n/ac MIMO WLAN SoC with 1.1Gb/s Over-the-Air Throughput

Ming He, Renaldi Winoto, Xiang Gao, Wayne Loeb, David Signoff, Wai Lau, Yuan Lu, Donghong Cui, Kun-Seok Lee, Sai-Wang Tam, Philip Godoy, Yung Chen, Sanghoon Joo, Changhui Hu, Arvind Anumula Paramanandam, Xiaoyue Wang, Chi-Hung Lin, Li Lin
Marvell, Santa Clara, CA

 

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2014 IDS 22.5

22.5: A 1.62GS/s Time-Interleaved SAR ADC with Digital Background Mismatch Calibration Achieving Interleaving Spurs Below 70dBFS

Nicolas Le Dortz1,2, Jean-Pierre Blanc1, Thierry Simon1, Sarah Verhaeren1, Emmanuel Rouat1, Pascal Urard1, Stéphane Le Tual1, Dimitri Goguet1, Caroline Lelandais-Perrault2, Philippe Benabes2
1 STMicroelectronics, Crolles, France
2 Supélec, Gif-sur-Yvette, France

 

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2014 IDS 26.2

26.2: A 205mW 32Gb/s 3-Tap FFE/6-Tap DFE Bidirectional Serial Link in 22nm CMOS

James Jaussi1, Ganesh Balamurugan1, Sami Hyvonen1, Tzu-Chien Hsueh1, Tawfiq Musah1, Gokce Keskin1, Sudip Shekhar1,*, Joseph Kennedy1, Shreyas Sen1, Rajesh Inti1, Mozhgan Mansuri1, Michael Leddige1, Bryce Horine1, Clark Roberts1, Randy Mooney2, Bryan Casper1
1 Intel, Hillsboro, OR
2 Intel, Mapleton, UT
* now with University of British Columbia, Vancouver, Canada

 

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2014 IDS 26.3

26.3: A Pin- and Power-Efficient Low-Latency 8-to-12Gb/s/wire 8b8w-Coded SerDes Link for High-Loss Channels in 40nm Technology

Anant Singh1, Dario Carnelli1, Altay Falay1, Klaas Hofstra1, Fabio Licciardello1, Kia Salimi1, Hugo Santos1, Amin Shokrollahi1, Roger Ulrich1, Christoph Walter1, John Fox2, Peter Hunt2, John Keay2, Richard Simpson2, Andy Stewart2, Giuseppe Surace2, Harm Cronie3
1 Kandou Bus, Lausanne, Switzerland
2 Kandou Bus, Northampton, United Kingdom
3 Lausanne, Switzerland

 

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2014 IDS 30.2

30.2: Digital PWM-Driven AMOLED Display on Flex Reducing Static Power Consumption

Jan Genoe1,2, Koji Obata3, Marc Ameys1, Kris Myny1, Tung Huei Ke1, Manoj Nag1, Soeren Steudel1, Sarah Schols1, Joris Maas4, Ashutosh Tripathi4, Jan-Laurens van der Steen4, Tim Ellis4,Gerwin H. Gelinck4, Paul Heremans1,2,4
1 imec, Leuven, Belgium
2 KU Leuven, Leuven, Belgium
3 Panasonic, Osaka, Japan
4 Holst Centre/TNO, Eindhoven, The Netherlands

 

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2013 Demo Session Videos

Announcements

ISSCC 2018 Advance Registration opens in November 2017

 


ISSCC 2017 TECH TRENDS pdf

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