VIDEO ARCHIVE: 2012 Demo Sessions

Industry Demonstration Session (IDS)
Academic Demonstration Session (ADS)

2012 Industrial Demo Session

The Industry Demonstration Session (IDS) featured live demonstrations of selected ICs that were also presented by industry authors in regular paper sessions. The IDS is intended to exemplify the real-life applications made possible by new ICs presented at ISSCC.

	3.1 A 22nm IA Multi-CPU and GPU System-on-Chip S. Damaraju¹, V. George¹, S. Jahagirdar¹, T. Khondker¹, R. Milstrey¹, S. Sarkar¹, S. Siers¹, I. Stolero², A. Subbiah¹ ¹ Intel, Folsom, CA ² Intel, Haifa, Israel watch video
	3.6 A 280mV-to-1.2V Wide-Operating-Range IA-32 Processor in 32nm CMOS S. Jain¹, S. Khare¹, S. Yada¹, A. V¹, P. Salihundam¹, S. Ramani¹, S. Muthukumar¹, S. M1, A. Kumar¹, S. Gb¹, R. Ramanarayanan¹, V. Erraguntla¹, J. Howard², S. Vangal², S. Dighe², G. Ruhl², P. Aseron², H. Wilson², N. Borkar², V. De², S. Borkar² ¹ Intel, Bangalore, India ² Intel, Hillsboro, OR watch video
	5.1 An 8Ω 2.5W 1%-THD 104dB(A)-Dynamic-Range Class-D Audio Amplifier with an Ultra-Low EMI System and Current Sensing for Speaker Protection A. Nagari, E. Allier, F. Amiard, V. Binet, C. Fraisse ST-Ericsson, Grenoble, France watch video
	5.8 A 330nA Energy-Harvesting Charger with Battery Management for Solar and Thermoelectric Energy Harvesting K. Kadirvel¹, Y. Ramadass², U. Lyles¹, J. Carpenter¹, A. Chandrakasan³, B. Lum-Shue-Chan¹ ¹ Texas Instruments, Melbourne, FL ² Texas Instruments, Dallas, TX ³ Massachusetts Institute of Technology, Cambridge, MA watch video
	6.5 A 160μA Biopotential Acquisition ASIC with Fully Integrated IA and Motion-Artifact Suppression N. Van Helleputte¹, S. Kim¹, H. Kim¹, J. Kim², C. Van Hoof ^1,3, R. Yazicioglu¹ ¹ imec, Heverlee, Belgium ² Samsung Advanced Institute of Technology, Yongin, Korea ³ KU Leuven, Leuven, Belgium watch video
	7.5 A 4.1pJ/b 16Gb/s Coded Differential Bidirectional Parallel Electrical Link A. Amirkhany¹, K. Kaviani¹, A. Abbasfar¹, F. Shuaeb², W. Beyene¹, C. Hoshino³, C. Madden1, K. Chang¹, C. Yuan¹ ¹ Rambus, Sunnyvale, CA ² Rambus, Bangalore, India ³ Rambus, Tokyo, Japan watch video
	10.3 A 1.45GHz 52-to-162GFLOPS/W Variable-Precision Floating-Point Fused Multiply-Add Unit with Certainty Tracking in 32nm CMOS H. Kaul, M. Anders, S. Mathew, S. Hsu, A. Agarwal, F. Sheikh, R. Krishnamurthy, S. Borkar Intel, Hillsboro, OR watch video
	11.6 A Temperature-to-Digital Converter for a MEMS-Based Programmable Oscillator with Better Than ±0.5ppm Frequency Stability M. Perrott¹, J. Salvia², F. Lee³, A. Partridge², S. Mukherjee², C. Arft², J-T. Kim², N. Arumugam², P. Gupta², S. Tabatabaei², S. Pamarti⁴, H. Lee², F. Assaderaghi² ¹ Masdar Institute of Science and Technology, Abu Dhabi, United Arab Emirates ² SiTime, Sunnyvale, CA ³ Fairchild Semiconductor, San Jose, CA ⁴ University of California, Los Angeles, Los Angeles, CA watch video
	12.1 A 32nm High-k Metal Gate Application Processor with GHz Multi-Core CPU S-H. Yang, S. Lee, J. Lee, J. Cho, H-J. Lee, D. Cho, J. Heo, S. Cho, Y. Shin, S. Yun, E. Kim, U. Cho, J. Son, C. Kim, J. Youn, Y. Chung, S. Park, S. Hwang Samsung Electronics, Yongin, Korea watch video
	12.5 A 464GOPS 620GOPS/W Heterogeneous Multi-Core SoC for Image-Recognition Applications Y. Tanabe, M. Sumiyoshi, M. Nishiyama, I. Yamazaki, S. Fujii, K. Kimura, T. Aoyama, M. Banno, H. Hayashi, T. Miyamori Toshiba, Kawasaki, Japan watch video
	19.3 A 40nm CMOS Single-Chip 50Gb/s DP-QPSK/BPSK Transceiver with Electronic Dispersion Compensation for Coherent Optical Channels D. Crivelli ^1,2, M. Hueda^1,2, H. Carrer^1,2, J. Zachan³, V. Gutnik³, M. Del Barco¹, R. Lopez¹, G. Hatcher³, J. Finochietto², M. Yeo³, A. Chartrand³, N. Swenson³, P. Voois³, O. Agazzi^1,3 ¹ ClariPhy, Cordoba, Argentina ² National University of Cordoba, Cordoba, Argentina ³ ClariPhy, Irvine, CA watch video
	22.9 A 1920×1080 3.65μm-Pixel 2D/3D Image Sensor with Split and Binning Pixel Structure in 0.11μm Standard CMOS S-J. Kim, B. Kang, J. Kim, K. Lee, C-Y. Kim, Kinam Kim Samsung Advanced Institute of Technology, Yongin, Korea watch video
	26.6 A Meter-Range UWB Transceiver Chipset for Around-the-Head Audio Streaming X. Wang¹, Y. Yu², B. Busze¹, H. Pflug¹, A. Young¹, X. Huang¹, C. Zhou¹, M. Konijnenburg¹, K. Philips¹, H. De Groot¹ ¹ imec - Holst Centre, Eindhoven, The Netherlands ² NXP Semiconductors, Eindhoven, The Netherlands watch video
	26.8 A 915MHz 120µW-RX/900µW-TX Envelope-Detection Transceiver with 20dB In-Band Interference Tolerance X. Huang¹, A. Ba^1,2, P. Harpe^1,3, G. Dolmans¹, H. De Groot¹, J. Long² ¹ imec - Holst Centre, Eindhoven, The Netherlands ² Delft University of Technology, Delft, The Netherlands ³ Eindhoven University of Technology, Eindhoven, The Netherlands watch video

2012 Academic Demo Session

The Academic Demonstration Session (ADS) featured live demonstrations of selected ICs presented by academics in regular paper sessions. The ADS is intended to demonstrate real-life applications made possible by new ICs presented this year

	6.8 A Wireless Magnetoresistive Sensing System for an Intra-Oral Tongue-Computer Interface H. Park¹, B. Gosselin², M. Kiani¹, H-M. Lee¹, J. Kim¹, X. Huo¹, M. Ghovanloo¹ ¹ Georgia Institute of Technology, Atlanta, GA ² Laval University, Quebec, QC, Canada watch video
	10.6 3D-MAPS: 3D Massively Parallel Processor with Stacked Memory D. Kim¹, K. Athikulwongse¹, M. Healy¹, M. Hossain¹, M. Jung¹, I. Khorosh¹, G. Kumar¹, Y-J. Lee¹, D. Lewis¹, T-W. Lin¹, C. Liu¹, S. Panth¹, M. Pathak¹, M. Ren¹, G. Shen¹, T. Song¹, D. Woo¹, X. Zhao¹, J. Kim², H. Choi³, G. Loh¹, H-H. Lee¹, S. Lim¹ ¹ Georgia Institute of Technology, Atlanta, GA ² KAIST, Daejeon, Korea ³ Amkor Technology, Seoul, Korea watch video
	11.5 A ±0.4°C (3σ) -70 to 200°C Time-Domain Temperature Sensor Based on Heat Diffusion in Si and SiO₂ C. Van Vroonhoven¹, D. D’Aquino², K. Makinwa¹ ¹ Delft University of Technology, Delft, The Netherlands ² National Semiconductor, Santa Clara, CA watch video
	12.4 A 320mW 342GOPS Real-Time Moving Object Recognition Processor for HD 720p Video Streams J. Oh, G. Kim, J. Park, I. Hong, S. Lee, H-J. Yoo KAIST, Daejeon, Korea watch video
	15.1 A 1kPixel CMOS Camera Chip for 25fps Real-TimeTerahertz Imaging Applications H. Sherry^1,2,3, J. Grzyb², Y. Zhao², R. Al Hadi², A. Cathelin¹, A. Kaiser³, U. Pfeiffer² ¹ STMicroelectronics, Crolles, France ² University of Wuppertal, Wuppertal, Germany ³ IEMN / ISEN, Lille, France watch video
	16.8 Voltage-Boosting Wireless Power Delivery System with Fast Load Tracker by ΔΣ-Modulated Sub-Harmonic Resonant Switching R. Shinoda, K. Tomita, Y. Hasegawa, H. Ishikuro Keio University, Yokohama, Japan watch video
	17.2 A 259.6μW Nonlinear HRV-EEG Chaos Processor with Body Channel Communication Interface for Mental Health Monitoring T. Roh, S. Hong, H. Cho, H-J. Yoo KAIST, Daejeon, Korea watch video
	17.3 A Sub-10nA DC-Balanced Adaptive Stimulator IC with Multimodal Sensor for Compact Electro-Acupuncture System K. Song, H. Lee, S. Hong, H. Cho, H-J. Yoo KAIST, Daejeon, Korea watch video
	22.2 A Global-Shutter CMOS Image Sensor with Readout Speed of 1Tpixel/s Burst and 780Mpixel/s Continuous Y. Tochigi¹, K. Hanzawa¹, Y. Kato¹, R. Kuroda¹, H. Mutoh², R. Hirose³, H. Tominaga³, K. Takubo³, Y. Kondo³, S. Sugawa¹ ¹ Tohoku University, Sendai, Japan ² Link Research, Odawara, Japan ³ Shimadzu, Kyoto, Japan watch video
	25.2 Over-10×-Extended-Lifetime 76%-Reduced-Error Solid-State Drives (SSDs) with Error-Prediction LDPC Architecture and Error-Recovery Scheme S. Tanakamaru, Y. Yanagihara, K. Takeuchi University of Tokyo, Tokyo, Japan watch video
	26.4 An Interference-Aware 5.8GHz Wake-Up Radio for ETCS J. Choi¹, K. Lee², S-O. Yun², S-G. Lee¹, J. Ko² ¹ KAIST, Daejeon, Korea ² PHYCHIPS, Daejeon, Korea watch video

VIDEO ARCHIVE: 2012 Demo Sessions

Industry Demonstration Session (IDS)
Academic Demonstration Session (ADS)

2012 Industrial Demo Session

3.1 A 22nm IA Multi-CPU and GPU System-on-Chip

3.6 A 280mV-to-1.2V Wide-Operating-Range IA-32 Processor in 32nm CMOS

5.1 An 8Ω 2.5W 1%-THD 104dB(A)-Dynamic-Range Class-D Audio Amplifier with an Ultra-Low EMI System and Current Sensing for Speaker Protection

5.8 A 330nA Energy-Harvesting Charger with Battery Management for Solar and Thermoelectric Energy Harvesting

6.5 A 160μA Biopotential Acquisition ASIC with Fully Integrated IA and Motion-Artifact Suppression

7.5 A 4.1pJ/b 16Gb/s Coded Differential Bidirectional Parallel Electrical Link

10.3 A 1.45GHz 52-to-162GFLOPS/W Variable-Precision Floating-Point Fused Multiply-Add Unit with Certainty Tracking in 32nm CMOS

11.6 A Temperature-to-Digital Converter for a MEMS-Based Programmable Oscillator with Better Than ±0.5ppm Frequency Stability

12.1 A 32nm High-k Metal Gate Application Processor with GHz Multi-Core CPU

12.5 A 464GOPS 620GOPS/W Heterogeneous Multi-Core SoC for Image-Recognition Applications

19.3 A 40nm CMOS Single-Chip 50Gb/s DP-QPSK/BPSK Transceiver with Electronic Dispersion Compensation for Coherent Optical Channels

22.9 A 1920×1080 3.65μm-Pixel 2D/3D Image Sensor with Split and Binning Pixel Structure in 0.11μm Standard CMOS

26.6 A Meter-Range UWB Transceiver Chipset for Around-the-Head Audio Streaming

26.8 A 915MHz 120µW-RX/900µW-TX Envelope-Detection Transceiver with 20dB In-Band Interference Tolerance

2012 Academic Demo Session

6.8 A Wireless Magnetoresistive Sensing System for an Intra-Oral Tongue-Computer Interface

10.6 3D-MAPS: 3D Massively Parallel Processor with Stacked Memory

11.5 A ±0.4°C (3σ) -70 to 200°C Time-Domain Temperature Sensor Based on Heat Diffusion in Si and SiO₂

12.4 A 320mW 342GOPS Real-Time Moving Object Recognition Processor for HD 720p Video Streams

15.1 A 1kPixel CMOS Camera Chip for 25fps Real-TimeTerahertz Imaging Applications

16.8 Voltage-Boosting Wireless Power Delivery System with Fast Load Tracker by ΔΣ-Modulated Sub-Harmonic Resonant Switching

17.2 A 259.6μW Nonlinear HRV-EEG Chaos Processor with Body Channel Communication Interface for Mental Health Monitoring

17.3 A Sub-10nA DC-Balanced Adaptive Stimulator IC with Multimodal Sensor for Compact Electro-Acupuncture System

22.2 A Global-Shutter CMOS Image Sensor with Readout Speed of 1Tpixel/s Burst and 780Mpixel/s Continuous

25.2 Over-10×-Extended-Lifetime 76%-Reduced-Error Solid-State Drives (SSDs) with Error-Prediction LDPC Architecture and Error-Recovery Scheme

26.4 An Interference-Aware 5.8GHz Wake-Up Radio for ETCS

Announcements

2014 CALL FOR PAPERS

ISSCC 2013 TECH TRENDS

2014 ADVANCE REGISTRATION
opens in November 2013

COMING SOON

VIDEO ARCHIVE: 2012 Demo Sessions

Industry Demonstration Session (IDS) Academic Demonstration Session (ADS)

2012 Industrial Demo Session

3.1 A 22nm IA Multi-CPU and GPU System-on-Chip

3.6 A 280mV-to-1.2V Wide-Operating-Range IA-32 Processor in 32nm CMOS

5.1 An 8Ω 2.5W 1%-THD 104dB(A)-Dynamic-Range Class-D Audio Amplifier with an Ultra-Low EMI System and Current Sensing for Speaker Protection

5.8 A 330nA Energy-Harvesting Charger with Battery Management for Solar and Thermoelectric Energy Harvesting

6.5 A 160μA Biopotential Acquisition ASIC with Fully Integrated IA and Motion-Artifact Suppression

7.5 A 4.1pJ/b 16Gb/s Coded Differential Bidirectional Parallel Electrical Link

10.3 A 1.45GHz 52-to-162GFLOPS/W Variable-Precision Floating-Point Fused Multiply-Add Unit with Certainty Tracking in 32nm CMOS

11.6 A Temperature-to-Digital Converter for a MEMS-Based Programmable Oscillator with Better Than ±0.5ppm Frequency Stability

12.1 A 32nm High-k Metal Gate Application Processor with GHz Multi-Core CPU

12.5 A 464GOPS 620GOPS/W Heterogeneous Multi-Core SoC for Image-Recognition Applications

19.3 A 40nm CMOS Single-Chip 50Gb/s DP-QPSK/BPSK Transceiver with Electronic Dispersion Compensation for Coherent Optical Channels

22.9 A 1920×1080 3.65μm-Pixel 2D/3D Image Sensor with Split and Binning Pixel Structure in 0.11μm Standard CMOS

26.6 A Meter-Range UWB Transceiver Chipset for Around-the-Head Audio Streaming

26.8 A 915MHz 120µW-RX/900µW-TX Envelope-Detection Transceiver with 20dB In-Band Interference Tolerance

2012 Academic Demo Session

6.8 A Wireless Magnetoresistive Sensing System for an Intra-Oral Tongue-Computer Interface

10.6 3D-MAPS: 3D Massively Parallel Processor with Stacked Memory

11.5 A ±0.4°C (3σ) -70 to 200°C Time-Domain Temperature Sensor Based on Heat Diffusion in Si and SiO2

12.4 A 320mW 342GOPS Real-Time Moving Object Recognition Processor for HD 720p Video Streams

15.1 A 1kPixel CMOS Camera Chip for 25fps Real-TimeTerahertz Imaging Applications

16.8 Voltage-Boosting Wireless Power Delivery System with Fast Load Tracker by ΔΣ-Modulated Sub-Harmonic Resonant Switching

17.2 A 259.6μW Nonlinear HRV-EEG Chaos Processor with Body Channel Communication Interface for Mental Health Monitoring

17.3 A Sub-10nA DC-Balanced Adaptive Stimulator IC with Multimodal Sensor for Compact Electro-Acupuncture System

22.2 A Global-Shutter CMOS Image Sensor with Readout Speed of 1Tpixel/s Burst and 780Mpixel/s Continuous

25.2 Over-10×-Extended-Lifetime 76%-Reduced-Error Solid-State Drives (SSDs) with Error-Prediction LDPC Architecture and Error-Recovery Scheme

26.4 An Interference-Aware 5.8GHz Wake-Up Radio for ETCS

Announcements

2014 CALL FOR PAPERS

ISSCC 2013 TECH TRENDS

2014 ADVANCE REGISTRATION opens in November 2013

COMING SOON

Industry Demonstration Session (IDS)
Academic Demonstration Session (ADS)

11.5 A ±0.4°C (3σ) -70 to 200°C Time-Domain Temperature Sensor Based on Heat Diffusion in Si and SiO₂

2014 ADVANCE REGISTRATION
opens in November 2013