ANALOG: Amplifiers, comparators, oscillators, filters, references; nonlinear analog circuits; digitally-assisted analog circuits; MEMS/sensor interface circuits.

DATA CONVERTERS: Nyquist-rate and oversampling A/D and D/A converters; embedded and application-specific A/D and D/A converters; analog to information conversion; time-to-digital converters.

DIGITAL ARCHITECTURES & SYSTEMS: Microprocessors, micro-controllers, applications processors, graphics processors; digital systems for communications, video and multimedia, machine-learning, deep-learning, neuromorphism, cryptographics, security and trusted computing, special-function acceleration, processing-in-memory; reconfigurable systems, near- and sub-threshold systems, digital architectures and systems for emerging applications (e.g. virtual reality – AR/VR and autonomous vehicles).

DIGITAL CIRCUITS: Building blocks for 2D/3D SoC such as intra-chip communication circuits, clock distribution techniques, soft-error and variation-tolerant circuits. Circuits for power management in digital applications: including voltage regulators, adaptive digital circuits, digital sensors; Near- and sub-threshold circuits; PLLs for digital clocking applications. Circuits for neuro-computing; Hardware security circuits including PUFs, TRNG, and attack-detection sensors.

IMAGERS, MEMS, MEDICAL, & DISPLAYS: Image sensors and SoCs; automotive, LIDAR, and ultrasonic sensors; MEMS sensor systems; wearable, implantable, ingestible electronics, biomedical SoCs, neural interfaces and closed-loop systems; biosensors, microarrays, and lab-on-a-chip; display electronics, displays with sensing functionality; sensing for AR/VR.

MEMORY: Static, dynamic, and non-volatile memories for stand-alone and embedded applications; memory/SSD controllers; high-bandwidth I/O interfaces; memories based on phase-change, magnetic, spin-transfer-torque, ferroelectric, and resistive materials; array architectures and circuits to improve low-voltage operation, power reduction, reliability, and fault tolerance; memory-subsystem enhancements, including in-memory logic functions, machine learning, artificial intelligence, and AR/VR.

POWER MANAGEMENT: Power control and management circuits, regulators; switched-mode power converter ICs using inductive, capacitive, and hybrid techniques; energy-harvesting circuits and systems; wide-bandgap topologies and gate-drivers; power and signal isolators; circuits for lighting, wireless power.

RF CIRCUITS and WIRELESS SYSTEMS*: Building blocks and complete solutions at RF, mm-Wave and THz frequencies for receivers, transmitters, frequency synthesizers, transceivers, SoCs, and SiPs. Innovative circuit-level and system-architecture solutions for established wireless standards and future systems or applications such as radar, sensing, and imaging.

TECHNOLOGY DIRECTIONS: Emerging IC and system solutions for: biomedical, sensor interfaces, analog signal processing, power management, computation, data storage, and communication; analog/mixed-signal techniques for security and machine learning; non-silicon-, carbon-, organic-, metal-oxide-, compound-semiconductor- and new-device-based circuits; nano, flexible, large-area, stretchable, printable, quantum, optical, and 3D-integrated electronics; spintronics.

WIRELINE: Receivers/transmitters/transceivers for wireline systems, including backplane transceivers, optical links, chip-to-chip
communications, 2.5/3D interconnect, copper-cable links, and equalizing on-chip links; exploratory I/O circuits for advancing data rates, power efficiency, and equalization; wireline transceiver building blocks (such as AGCs, front ends, equalizers, clock-generation and distribution circuits including PLLs, clock-and-data recovery, line drivers, and hybrids).

*Papers submitted to this category will be reviewed by either the RF or Wireless Subcommittees.

Firm Deadline for Electronic Submission of Papers:
September 10, 2018 3:00 PM Eastern Daylight Time (19:00 GMT)