CICC

The ISSCC 2022 Conference Theme is “INTELLIGENT SILICON FOR A SUSTAINABLE WORLD”

After a year in a worldwide pandemic and strong environmental changes, the circuit design community is evolving to support a more sustainable world. Without change, Integrated Circuits will become the dominant energy consumer and source of carbon emissions in the future. Low-power circuit design is becoming more sophisticated in all different areas of digital computation, machine learning, and analog design. Wireless and Wireline advances will help optimizing energy of local and global communications. Sensor design can be deployed to measure environmental data and optimize energy consumption. Power
management techniques are required in a majority of circuits to extend systems’ lifetime. Finally, new technologies are giving some opportunities to develop innovative circuits, reduce fabrication impact, and improve recyclability.

Innovative and original papers are solicited in subject areas including (but not limited to) the following:

ANALOG: Circuits with analog-dominated innovation; amplifiers, comparators, oscillators, filters, references; nonlinear analog circuits; digitally-assisted analog circuits; Sensor interface circuits; analog circuits in sub-10nm scaled technologies

DATA CONVERTERS: Nyquist-rate and oversampling A/D and D/A converters; embedded and application-specific A/D and D/A converters; analog to information conversion; time-to-digital converters.

DIGITAL CIRCUITS and ARCHITECTURES & SYSTEMS*: Digital circuits, building blocks, and complete systems (monolithic, 2.5D, and 3D) for microprocessors, micro-controllers, application processors, graphics processors; digital systems for communications, video and multimedia, cryptography, smart cards, security and trusted computing, accelerators, reconfigurable systems, near- and sub-threshold systems, emerging applications. Digital circuits for intra-chip communication, clock distribution, soft-error and variation-tolerant design, power management (i.e. voltage regulators, adaptive digital circuits, digital sensors), PLLs for digital clocking applications, circuit techniques for neuro-computing, and security circuits (i.e. PUFs, TRNGs, side-channel attack countermeasures, and attack-detection sensors).

IMAGERS, MEMS, MEDICAL, & DISPLAYS: Image sensors and SoCs; automotive, LIDAR, and ultrasonic sensors; MEMS sensor systems; wearable, implantable, ingestible electronics, biomedical SoCs, neural interfaces and closed-loop systems; biosensors, microarrays, and lab-on-a-chip; display electronics, displays with sensing functionality; sensing for AR/VR.

MACHINE LEARNING and AI: Chips demonstrating system, architecture and circuit innovations for machine learning and artificial intelligence: processor architectures, accelerators and digital circuits; mixed-signal, analog, near-sensor and in-sensor processing schemes; all architectures and circuits leveraging near-memory and in-memory computation for AI using volatile or non-volatile memories. Hardware optimizations for new ML models including transformers, hyper-dimensional computing, spiking neural networks, etc.

MEMORY: Static, dynamic, and non-volatile memories for stand-alone and embedded applications; memory/SSD controllers; high-bandwidth I/O interfaces; memories based on phase-change, magnetic, spin-transfer-torque, ferroelectric, and resistive materials; array architectures and circuits to improve low-voltage operation, power reduction, reliability, and fault tolerance; application-specific circuit enhancements within the memory subsystem, including in-memory logic functions and compute.

POWER MANAGEMENT: Power management and control circuits, regulators; switched-mode power converter ICs using inductive, capacitive, and hybrid techniques; energy harvesting circuits and systems; wide-bandgap topologies and gate-drivers; power and signal isolators; robust power management circuits for automotive and other harsh environments; circuits for lighting, wireless power and envelope modulators.

RF CIRCUITS and WIRELESS SYSTEMS**: Building blocks and complete solutions at RF, mm-Wave and THz frequencies for receivers, transmitters, frequency synthesizers, transceivers, SoCs, and SiPs. Innovative circuit-level and system-architecture solutions for established wireless standards and future systems or applications such as radar, sensing, and imaging.

TECHNOLOGY DIRECTIONS: Emerging IC and system solutions for: biomedical, sensor interfaces, analog signal processing, power management, computation (including non-CMOS machine learning), data storage, and communication; non-silicon-, carbon-, organic-, metal-oxide-, compound-semiconductor- and new-device-based circuits; nano, flexible, large-area, stretchable, printable, spintronics, quantum, optical, integrated photonics, and 3D-integrated electronics.

WIRELINE: Receivers/transmitters/transceivers for wireline systems, including backplane transceivers, copper-cable links, chip-to-chip communications, 2.5/3D interconnect, on-chip links, optical links, and silicon photonics; exploratory I/O circuits for advancing data rates, bandwidth density, power efficiency, equalization, robustness, adaptation capability, and design methodology; building blocks for wireline transceivers (such as AGCs, analog and ADC/DAC-based front ends, equalizers, clock generation and distribution circuits including PLLs, line drivers, and hybrids).

*This category will be reviewed by either the Digital Circuits or Digital Architecture/Systems subcommittee.
**Papers submitted to this category will be reviewed by either the RF or Wireless Subcommittees.

Firm Deadline for Electronic Submission of Papers:
September 8, 2021 3:00 PM Eastern Daylight Time (19:00 GMT)