CICC

2021 Technical Committees

Technical Editors

Jason H. Anderson
University of Toronto, Toronto, Canada

Leonid Belostotski
The University of Calgary, Calgary, Canada

Dustin Dunwell
Huawei Technologies, Markham, Canada

Vincent Gaudet
University of Waterloo,Waterloo, Canada

Glenn Gulak
University of Toronto, Toronto, Canada

James W. Haslett
The University of Calgary, Calgary, Canada

Shahriar Mirabbasi
University of British Columbia, Vancouver, Canada

Multi-Media Coordinator and Digest Editor

Dave Halupka
StarIC, Toronto, Canada

Program Chair

Makoto Ikeda
University of Tokyo, Tokyo, Japan

Program Vice-Chair

Edith Beigné
Facebook, Menlo Park, CA

Forum Committee

Chair: David Robertson
Analog Devices, Wilmington,

Chair-Elect: Ali Sheikholeslami
University of Toronto, Toronto, Canada

William Redman-White
HiLight Semiconductor, Southampton, United Kingdom

Franz Dielacher
Infineon Technologies, Villach, Austria

Boris Murmann
Stanford University, Stanford, CA

Chih-Ming Hung
MediaTek, Taipei, Taiwan

Vivek De
Intel, Hillsboro, OR

Fatih Hamzaoglu
Intel, Hillsboro, OR

Kostas Doris
NXP, Eindhoven, The Netherlands

Masato Motomura
Tokyo Institute of Technology, Yokohama, Japan

Andreia Cathelin
STMicroelectronics, Crolles Cedex, France

ITPC European Regional Chair: Tim Piessens
ICsense, Leuven, Belgium

ITPC European Regional Vice Chair: Bruce Rae
ST Microelectronics Imaging Division, Edinburgh, United Kingdom

ITPC Far East Regional Chair: Long Yan
Samsung Electronics, Hwaseong-si, Korea

ITPC Far East Regional Vice Chair: Yun-Shiang Shu
MediaTek, Hsinchu City, Taiwan

Analog Subcommittee

Chair: Kofi Makinwa
Delft University of Technology, Delft, The Netherlands

Jens Anders
University of Stuttgart, Stuttgart, Germany

Marco Berkhout
Goodix Technology

David Blaauw
University of Michigan, Ann Arbor, MI

Youngcheol Chae
Yonsei University, Seoul, Korea

Drew Hall
University of California, San Diego, La Jolla, CA

Mahdi Kashmiri
Broadcom, San Jose, CA

Taeik Kim
Samsung Electronics, Gyeonggi-do, Korea

Man-Kay Law
University of Macau, Macau, China

Tim Piessens
ICsense, Leuven, Belgium

Viola Schafer
Texas Instruments, Freising, Germany

Wen-Chieh Wang
MediaTek, Hsinchu City, Taiwan

Jiawei Xu
Fudan University, Shanghai, China

Data Converters Subcommittee

Chair: Michael Flynn
University of Michigan at Ann Arbor, Ann Arbor, MI

Ahmed Ali
Analog Devices, Greensboro, NC

Seyfi Bazarjani
Qualcomm Technologies, San Diego, CA

Yun Chiu
University of Texas at Dallas, Richardson, TX

Marco Corsi
Texas Instruments, Dallas, TX

Chih-Cheng Hsieh
National Tsing Hua University, Hsinchu, Taiwan

John Keane
Keysight Technologies, Santa Clara, CA

Jongwoo Lee
Samsung Electronics, Gyunggi-do, Korea

Dominique Morche
Département Architecture Conception et Logiciel Embarqué (DACLE), Grenoble Cedex, France

Takashi Oshima
Hitachi, Tokyo,Japan

Yun-Shiang Shu
Mediatek, Hsinchu City, Taiwan

Bob Verbruggen
Xilinx, Dublin, Ireland

Jan Westra
Broadcom, Bunnik, The Netherlands

Digital Architectures & Systems (DAS) Subcommittee

Chair: Thomas Burd
Advanced Micro Devices, Santa Clara, CA

Massimo Alioto
National University of Singapore, Singapore

Hsie-Chia Chang
National Chiao Tung University, HsinChu, Taiwan

Shidhartha Das
Arm, Cambridge, United Kingdom

Christopher Gonzalez
IBM, Yorktown Heights, NY

Junho Huh
Samsung, Gyeonggi-do, Korea

Hugh Mair
MediaTek, Austin, TX

Sanu Mathew
Intel, Hillsboro, OR

Hirofumi Shinohara
Waseda University, Fukuoka, Japan

Ingrid Verbauwhede
KU Leuven, Leuven, Belgium

Digital Circuits (DCT) Subcommittee

Chair: Keith Bowman
Qualcomm, Raleigh, NC

Koji Hirairi
Sony LSI Design, Kanagawa, Japan

Ping-Hsuan Hsieh
National Tsing Hua University, Hsinchu City, Taiwan

Tanay Karnik
Intel, Hillsboro, OR

Alicia Klinefelter
NVidia, Durham, NC

Huichu Liu
Facebook Agile Silicon Team (FAST), Menlo Park, CA

Mijung Noh
Samsung Electronics, Gyeonggi-do, Korea

Arijit Raychowdhury
Georgia Institute of Technology, Atlanta, GA

Mingoo Seok
Columbia University, New York, NY

Yvain Thonnart
CEA-Leti, Grenoble, France

IMMD Subcommittee

Chair: Chris Van Hoof
imec, Leuven, Belgium

Joonsung Bae
Kangwon National University, Kangwon-do, Korea

Gert Cauwenberghs
University of California, San Diego, La Jolla, CA

Calvin Yi-Ping Chao
TSMC, Hsinchu, Taiwan

Seong-Jin Kim
Ulsan National Institute of Science and Technology, Ulsan, Korea

Junghyup Lee
DGIST, Daegu, Korea

Jennifer Lloyd
Analog Devices, San Jose, CA

Masayuki Miyamoto
Wacom, Tokyo, Japan

Pedram Mohseni
Case Western Reserve University, Cleveland, OH

Rikky Muller
University of California Berkeley, Berkeley, CA

Kazuko Nishimura
Panasonic Corporation, Moriguchi, Japan

Matteo Perenzoni
Fondazione Bruno Kessler(FBK), Trento, Italy

Bruce Rae
ST Microelectronics, Edinburgh, United Kingdom

Esther Rodriguez-Villegas
Imperial College London, London, United Kingdom

Vyshnavi (Vyshi) Suntharalingam
MIT Lincoln Laboratory, Lexington, MA

Johan Vanderhaegen
Google LLC, Mountain View, CA

Hayato Wakabayashi
Sony Semiconductor Solutions Corporation, Kanagawa, Japan

Jerald Yoo
National University of Singapore, Singapore

Machine Learning Subcommittee

Chair: Marian Verhelst
KU Leuven, Heverlee, Belguim

Luca Benini
ETHZ and UNIBO ETZ, Zurich, Switzerland

Geoffrey W. Burr
IBM Research, San Jose, CA

Jun Deguchi
Kioxia Corporation, Kawasaki, Japan

Yan Li
Western Digital, Milpitas, CA

Surk Hwan Lim
Samsung, Korea

Machine Learning Subcommittee (continued)

Yongpan Liu
Tsinghua University, Beijing, China

Masato Motomura
Tokyo Institute of Technology, Tokyo, Japan

Vivienne Sze
MIT, Cambridge, MA

Rangharajan Venkatesan
NVIDIA Corporation, Santa Clara, CA

Memory Subcommittee

Chair: Jonathan Chang
TSMC, Hsinchu, Taiwan

Seung-Jun Bae
Samsung, Gyenggi-Do, Korea

Meng-Fang Chang
National Tsing-Hua University, Hsinchu, Taiwan

Ru Huang
Peking University, Beijing, China

Eric Karl
Intel, Portland, OR

Kyu-Hyoun (KH) Kim
IBM T.J. Watson, Yorktown Heights, NY

Dong Uk Lee
SK hynix, Gyeonggi-do, Korea

Seung-Jae Lee
Samsung, Gyeonggi-do, Korea

Violante Moschiano
Micron, Avezzano (AQ), Italy

Bor-Doou Rong
Etron, Hsinchu, Taiwan

Shinichiro Shiratake
Kioxia, Yokohama,Japan

Yasuhiko Taito
Renesas, Tokyo, Japan

Power Management Subcommittee

Chair: Yogesh Ramadass
Texas Instruments, San Jose, CA

Ke-Horng Chen
National Chiao Tung University, Hsinchu, Taiwan

Min Chen
Analog Devices, Milpitas, CA

Chan-Hong Chern
TSMC, Hsinchu, Taiwan

Li Geng
Xi’an Jiaotong University, China

Kuo-Chun Hsu
MediaTek, Hsinchu, Taiwan

Johan Janssens
ON Semiconductor, Mechelen, Belgium

Harish Krishnamurthy
Intel, Hillsboro, OR

Hoi Lee
The University of Texas at Dallas, Richardson, TX

Yan Lu
University of Macau, Taipa, Macao

Kosuke Miyaji
Shinshu University, Nagano, Japan

Jiseon Paek
Samsung Electronics, S. Chungchung Province, Korea

Gael Pillonnet
CEA-Léti, Grenoble, France

Robert Pilawa
University of California – Berkeley, Berkeley, CA

Jason Stauth
Dartmouth College, Hanover, NH

Chen-Kong Teh
Toshiba Semiconductor,  Kawasaki, Japan

Gerard Villar-Pique
NXP Semiconductor,  Brabant, The Netherlands

Bernhard Wicht
University of Hannover,  Hannover, Germany

RF Subcommittee

Chair: Jan Craninckx
IMEC, Leuven, Belgium

Shuhei Amakawa
Hiroshima University, Higashihiroshima, Japan

Yves Baeyens
Nokia – Bell Labs, Murray Hill, NJ

Andrea Bevilacqua
University of Padova, Padova, Italy

James Buckwalter
University of California Santa Barbara, Santa Barbara, CA

Jaehyouk Choi
KAIST, Daejeon, Korea

Wei Deng
Tsinghua University, Beijing, China

Ramesh Harjani
University of Minnesota, Minneapolis, MN

Abbas Komijani
Apple, Mountain View, CA

Salvatore Levantino
Politecnico di Milano, Milan, Italy

Toshiya Mitomo
Toshiba, Kanagawam Japan

Patrick Reynaert
KU Leuven, Leuven, Belgium

Swaminathan Sankaran
Texas Instruments, Dallas, TX

Jeff Walling
Skyworks Solutions Inc, Hillsboro, OR

Hua Wang
Georgia Institute of Technology, Atlanta, GA

Wanghua Wu
Samsung, San Jose, CA

Hongtao Xu
Fudan University, Shanghai, China

Conan Zhan
MediaTek, HsinChu, Taiwan

Technology Directions Subcommittee

Chair: Makoto Nagata
Kobe University, Kobe, Japan

Edoardo Charbon
EPFL, Neuchâtel, Switzerland

Denis Daly
Apple, Wellesley, MA

Frederic Gianesello
STMicroelectronics, Crolles, France

Shawn Shuo-Hung Hsu
National Tsing Hua University, Hsinchu, Taiwan

Patrick Mercier
University of California San Diego, San Diego, CA

Munehiko Nagatani
NTT Corporation, Kanagawa, Japan

Sudip Shekhar
University of British Columbia, Vancouver, Canada

Nick Van Helleputte
imec, Leuven, Belgium

Sriram Vangal
Intel, Hillsboro, OR

Naveen Verma
Princeton University, Princeton, NJ

Long Yan
Samsung Electronics, Hwaseong-si, Korea

Rabia Tugce Yazicigil
Boston University, Boston, MA

Milin Zhang
Tsinghua University, Beijing, China

Wireless Subcommittee

Chair: Stefano Pellerano
Intel, Hillsboro, OR

Matteo Bassi
Infineon Technologies AG, Villach, Austria

Venumadhav Bhagavatula
Samsung Semiconductor, San Jose, CA

Yuan-Hung Chung
MediaTek, Hsinchu, Taiwan

Theodoros Georgantas
Broadcom, Athens, Greece

Vito Giannini
Uhnder, Austin, TX

Jane Gu
University of California Davis, Davis, CA

Hiroyuki Ito
Tokyo Institute of Technology, Yokohama, Japan

Nagendra Krishnapura
Indian Institute of Technology Madras, Chennai, India

Jri Lee
National Taiwan University, Taipei, Taiwan

Yao-Hong Liu
imec, Eindhoven, The Netherlands

Byung-Wook Min
Yonsei University, Seoul, Korea

Sudhakar Pamarti
University of California Los Angeles (UCLA), Los Angeles, CA

Bodhisatwa Sadhu
IBM T. J. Watson Research Center, Yorktown Heights, NY

Maryam Tabesh
Google, Mountain View, CA

Yiwu Tang
Qualcomm Technologies, San Diego, CA

David Wentzlof
University of Michigan, Ann Arbor, MI

Renaldi Winoto
Mojo Vision, Saratoga, CA

Wireline Subcommittee

Chair: Frank O’Mahony
Intel, Hillsboro, OR

Amir Amirkhany
Samsung Semiconductor, San Jose, CA

Tony Chan Carusone
University of Toronto, Toronto, Canada

Mike Shuo-Wei Chen
USC, Los Angeles, CA

Wei-Zen Chen
National Chiao Tung University (NCTU), Hsin-Chu, Taiwan

Yohan Frans
Xilinx, San Jose, CA

Friedel Gerfers
Technische Universität Berlin, Berlin, Germany

Byungsub Kim
Pohang University, Gyeongsangbukdo, Korea

Takashi Takemoto
Hokkaido University, Hokkaido, Japan

Thomas Toifl
Cisco Systems, Wallisellen, Switerzland

C. Patrick Yue
Hong Kong University of Science and Technology, Clear Water Bay, Hong Kong

Bo Zhang
Broadcom Limited, Irvine, CA