CICC

2019 Technical Committees

Technical Editors

Jason H. Anderson
University of Toronto, Toronto, Canada

Leonid Belostotski
The University of Calgary, Calgary, Canada

Dustin Dunwell
Huawei Technologies, Markham, Canada

Vincent Gaudet
University of Waterloo,Waterloo, Canada

Glenn Gulak
University of Toronto, Toronto, Canada

James W. Haslett
The University of Calgary, Calgary, Canada

Dave Halupka
Kapik Integration, Toronto, Canada

Multi-Media Coordinator

Dave Halupka
Kapik Integration, Toronto, Canada

Program Chair

Eugenio Cantatore
Eindhoven University of Technology, Eindhoven, The Netherlands

Program Vice-Chair

Un-Ku Moon
Oregon State University, Corvallis, OR

Forum Committee

Chair: Andreia Cathelin
STMicroelectronics, Crolles Cedex, France

Vice-Chair: David Robertson
Analog Devices, Wilmington, MA

Sonia Leon
Intel Mobile Communications, Santa Clara, CA

William Redman-White
HiLight Semiconductor, Southampton, United Kingdom

Franz Dielacher
Infineon Technologies, Villach, Austria

Sven Mattisson
Ericsson AB, Lund, Sweden

Stefan Rusu
TSMC, Sunnyvale, CA

Albert Theuwissen
Harvest Imaging, Bree, Belgium

Makoto Ikeda
University of Tokyo, Tokyo, Japan

Bryan Ackland
Stevens Institute of Tech., Hoboken, NJ

EU Representative: Yiannos Manoli
University of Freiburg – IMTEK, Freiburg, Germany

FE Representative: Makoto Takamiya
University of Tokyo, Tokyo, Japan

Analog Subcommittee

Chair: Kofi Makinwa
Delft University of Technology, Delft, The Netherlands

David Blaauw
University of Michigan, Ann Arbor, MI

Youngcheol Chae
Yonsei University, Seoul, Korea

Mahdi Kashmiri
Robert Bosch Research and Technology Center, Palo Alto, CA

Byungsub Kim
POSTECH, Gyeongsangbukdo, Korea

Taeik Kim
Samsung Electronics, Gyeonggi-do, Korea

Tai-Haur Kuo
National Cheng Kung University, Tainan, Taiwan

Man-Kay Law
University of Macau, Macau, China

Yiannos Manoli
University of Freiburg – IMTEK, Freiburg, Germany

Mike Perrott
Nashua, NH

Tim Piessens
ICsense, Leuven, Belgium

Wen-Chieh Wang
MediaTek, Hsinchu City, Taiwan

Data Converters Subcommittee

Chair: Michael Flynn
University of Michigan at Ann Arbor, Ann Arbor, MI

Ahmed Ali
Analog Devices, Greensboro, NC

Yun Chiu
University of Texas at Dallas, Richardson, TX

Kostas Doris
NXP, Eindhoven, The Netherlands

John Keane
Keysight Technologies, Santa Clara, CA

Tai-Cheng Lee
National Taiwan University, Taipei, Taiwan

Dominique Morche
Département Architecture Conception et Logiciel Embarqué (DACLE), Grenoble Cedex, France

Takashi Oshima
Hitachi, Tokyo,Japan

Yun-Shiang Shu
Mediatek, Hsinchu City, Taiwan

Venkatesh Srinivasan
Texas Instruments, Dallas, TX

Matt Straayer
Maxim Integrated Products, North Chelmsford, MA

Seng-Pan (Ben) U
University of Macau, Taipa, Macau

Bob Verbruggen
Xilinx, Dublin, Ireland

Jan Westra
Broadcom, Bunnik, The Netherlands

Digital Architectures & Systems (DAS) Subcommittee

Chair: Byeong-Gyu Nam
Chungnam National University, Daejeon, Korea

Thomas Burd
Advanced Micro Devices, Sunnyvale, CA

Hsie-Chia Chang
National Chiao Tung University, HsinChu, Taiwan

Christopher Gonzalez
IBM, Yorktown Heights, NY

Wookyeong Jeong
Samsung, Gyeonggi-Do, Korea

Muhammad Khellah
Intel, Hillsboro, OR

Dejan Markovic
UCLA, Los Angeles, CA

Mahesh Mehendale
Texas Instruments, Bangalore, India

Masato Motomura
Hokkaido University, Sapporo, Japan

James Myers
ARM, Cambridgeshire, United Kingdom

Ingrid Verbauwhede
KU Leuven, Leuven, Belgium

Digital Circuits (DCT) Subcommittee

Chair: Edith Beigné
Facebook, Menlo Park, CA

Massimo Alioto
National University of Singapore, Singapore

Keith Bowman
Qualcomm, Raleigh, NC

Vivek De
Intel, Hillsboro, OR

Wim Dehaene
Kuleuven-MICAS, Leuven, Belgium

Koji Hirairi
Sony LSI Design, Kanagawa, Japan

Alicia Klinefelter
NVidia, Durham, NC

John Maneatis
True Circuits, Los Altos, CA

Phillip Restle
IBM T. J. Watson Research Center, Yorktown Heights, NY

Mingoo Seok
Columbia University, New York, NY

Youngmin Shin
Samsung, Gyeonggi-Do, Korea

Hirofumi Shinohara
Waseda University, Fukuoka, Japam

Dennis Sylvester
University of Michigan, Ann Arbor, MI

Ping-Ying Wang
CMOS-Crystal, Hsinchu City, Taiwan

IMMD Subcommittee

Chair: Chris Van Hoof
imec, Leuven, Belgium

Joonsung Bae
Kangwon National University, Kangwon-do, Korea

Gert Cauwenberghs
University of California, San Diego, La Jolla, CA

Calvin Yi-Ping Chao
TSMC, Hsinchu, Taiwan

Yoon-Kyung Choi
Samsung, Gyeonggi-do, Korea

Jun Deguchi
Toshiba Memory Corporation, Kawasaki,Japan

Keith Fife
4Catalyzer, Palo Alto, CA

Morris (Ming-Dou) Ker
National Chiao-Tung University, Hsinchu, Taiwan

Michael Kraft
KULeuven, Leuven, Belgium

Pedram Lajevardi
Robert Bosch LLC, Palo Alto, CA

Masayuki Miyamoto
Wacom, Tokyo, Japan

Pedram Mohseni
Case Western Reserve University, Cleveland, OH

Rikky Muller
University of California Berkeley, Berkeley, CA

Kazuko Nishimura
Panasonic Corporation, Moriguchi, Japan

Matteo Perenzoni
Fondazione Bruno Kessler(FBK), Trento, Italy

Bruce Rae
ST Microelectronics, Edinburgh, United Kingdom

Esther Rodriguez-Villegas
Imperial College London, London, United Kingdom

 

Hayato Wakabayashi
Sony Semiconductor Solutions Corporation, Kanagawa, Japan

Memory Subcommittee

Chair: Jonathan Chang
TSMC, Hsinchu, Taiwan

Seung-Jun Bae
Samsung, Gyenggi-Do, Korea

Meng-Fang Chang
National Tsing-Hua University, Hsinchu, Taiwan

Sungdae Choi
SK Hynix Semiconductor, Icheon, Korea

Fatih Hamzaoglu
Intel, Hillsboro, OR

Kyu-Hyoun (KH) Kim
IBM T.J. Watson, Yorktown Heights, NY

Dong Uk Lee
SK hynix, Gyeonggi-do, Korea

Yan Li
Western Digital, Milpitas, CA

Jongmin Park
SK Hynix, Gyeonggi-di, Korea

Ki-Tae Park
Samsung, Gyeonggi, Korea

Chun Shiah
Etron, Hsinchu, Taiwan

Shinichiro Shiratake
Toshiba Memory Device Technology R&D Center, Yokohama,Japan

Wolfgang Spirkl
Micron Semiconductor, Munich, Germany

Yasuhiko Taito
Renesas, Tokyo, Japan

Power Management Subcommittee

Chair: Yogesh Ramadass
Texas Instruments, San Jose, CA

Min Chen
Analog Devices, Milpitas, CA

Chan-Hong Chern
TSMC, Hsinchu, Taiwan

Yuan Gao
IME, A*STAR, Singapore, Singapore

Zhiliang Hong
Fudan University, Shanghai, China

Yen Hsun Hsu
Mediatek,  Hsin Chu, Taiwan

Johan Janssens
ON Semiconductor, Mechelen, Belgium

Hoi Lee
The University of Texas at Dallas, Richardson, TX

Robert Pilawa
University of California – Berkeley, Berkeley, CA

Jason Stauth
Dartmouth College, Hanover, NH

Makoto Takamiya
University of Tokyo, Tokyo, Japan

Chen-Kong Teh
Toshiba Semiconductor,  Kawasaki, Japan

Gerard Villar-Pique
NXP Semiconductor,  Brabant, The Netherlands

Bernhard Wicht
University of Hannover,  Hannover, Germany

RF Subcommittee

Chair: Piet Wambacq
imec, Heverlee, Belgium

Andrea Bevilacqua
University of Padova, Padova, Italy

Jaehyouk Choi
Ulsan National Institute of Science Technology, Ulsan, Korea

Krzysztof Dufrene
Intel, Linz, Austria

Minoru Fujishima
Hiroshima University, Higashi-hiroshima, Japan

Xiang Gao
Zhejiang University, Hangzhou, China

Brian Ginsburg
Texas Instruments, Dallas, TX

Giuseppe Gramegna
Radio Frequency Systems (RFS), Golfe Juan, France

Ramesh Harjani
University of Minnesota, Minneapolis, MN

Payam Heydari
UCI, Irvine, CA

Chih-Ming Hung
MediaTek, Taipei, Taiwan

Abbas Komijani
Apple, Mountain View, CA

Harish Krishnaswamy
Columbia University, New York, NY

John Long
University of Waterloo, Waterloo, Canada

Andrea Mazzanti
Università degli Studi di Pavia, Pavia, Italy

Kohei Onizuka
Toshiba, Kanagawa,Japan

Jiayoon Ru
Broadcom, Irvine, CA

Hua Wang
Georgia Institute of Technology, Atlanta, GA

Conan Zhan
MediaTek, HsinChu, Taiwan

Technology Directions Subcommittee

Chair: Makoto Nagata
Kobe University, Kobe, Japan

Edoardo Charbon
EPFL & QuTech, Neuchâtel, Switzerland

Wim Dehaene
Kuleuven-MICAS, Leuven, Belgium

Antoine Dupret
CEA, Gif-sur-Yvette, France

Frederic Gianesello
STMicroelectronics, Crolles, France

Kush Gulati
Omni Design Tech., Milpitas, CA

Pui-In Mak
University of Macau, Macau, China

Patrick Mercier
University of California San Diego, San Diego, CA

Shahriar Mirabbasi
University of British Columbia, Vancouver, Canada

Shuichi Nagai
Panasonic, Osaka,Japan

Sriram Vangal
Intel, USA

Nick Van Helleputte
imec, Leuven, Belgium

Naveen Verma
Princeton University, Princeton, NJ

Long Yan
Samsung Electronics, Hwaseong-si, Korea

Wireless Subcommittee

Chair: Stefano Pellerano
Intel, Hillsboro, OR

Matteo Bassi
Infineon Technologies AG, Villach, Austria

Theodoros Georgantas
Broadcom, Athens, Greece

Danielle Griffith
Texas Instruments, Dallas, TX

Xin He
NXP, Eindhoven, The Netherlands

Nagendra Krishnapura
Indian Institute of Technology Madras, Chennai, India

Kyoo Hyun Lim
FCI, Gyeonggi-do, Korea

Yao-Hong Liu
imec, Eindhoven, The Netherlands

Howard C. Luong
Hong Kong University of Science and Technology, Kowloon, Hong Kong

Hideaki Majima
Toshiba, Kawasaki, Japan

David McLaurin
Analog Devices, Raleigh, NC

Arun Natarajan
Oregon State University, Corvallis, OR

Sudhakar Pamarti
University of California Los Angeles (UCLA), Los Angeles, CA

Yiwu Tang
Qualcomm Technologies, San Diego, CA

Yuu Watanabe
Waseda University, Kanagawa, Japan

Renaldi Winoto
Tectus Corp, Saratoga, CA

Alan Chi-Wai Wong
EnSilica, Oxfordshire, United Kingdom

Ken Yamamoto
Sony, Kanagawa, Japan

Wireline Subcommittee

Chair: Frank O’Mahony
Intel, Hillsboro, OR

Amir Amirkhany
Samsung Semiconductor, San Jose, CA

Hyeon-Min Bae
KAIST, Daejong, Korea

Tony Chan Carusone
University of Toronto, Toronto, Canada

Mike Shuo-Wei Chen
USC, Los Angeles, CA

Simone Erba
STMicroelectronics, Pavia, Italy

Yohan Frans
Xilinx, San Jose, CA

Friedel Gerfers
Technische Universität Berlin, Berlin, Germany

Andrew Joy
Marvell, Irvine, CA

Jaeha Kim
Seoul National University, Seoul, Korea

Mounir Meghelli
IBM ThomasJ Watson Research Center, Yorktown Heights, NY

Roberto Nonis
Infineon, Villach, Austria

Sam Palermo
Texas A&M University, College Station, TX

Takayuki Shibasaki
Fujitsu Laboratories, Kawasaki, Japan

Bo Zhang
Broadcom Limited, Irvine, CA