CICC

2020 Technical Committees

Technical Editors

Jason H. Anderson
University of Toronto, Toronto, Canada

Leonid Belostotski
The University of Calgary, Calgary, Canada

Dustin Dunwell
Huawei Technologies, Markham, Canada

Vincent Gaudet
University of Waterloo,Waterloo, Canada

Glenn Gulak
University of Toronto, Toronto, Canada

James W. Haslett
The University of Calgary, Calgary, Canada

Dave Halupka
StarIC, Toronto, Canada

Shahriar Mirabbasi
University of British Columbia, Vancouver, Canada

Multi-Media Coordinator

Dave Halupka
StarIC, Toronto, Canada

Program Chair

Un-Ku Moon
Oregon State University, Corvallis, OR

Program Vice-Chair

Makoto Ikeda
University of Tokyo, Tokyo, Japan

Forum Committee

Chair: Andreia Cathelin
STMicroelectronics, Crolles Cedex, France

Vice-Chair: David Robertson
Analog Devices, Wilmington, MA

William Redman-White
HiLight Semiconductor, Southampton, United Kingdom

Franz Dielacher
Infineon Technologies, Villach, Austria

Boris Murmann
Stanford University, Stanford, CA

Chih-Ming Hung
MediaTek, Taipei, Taiwan

Vivek De
Intel, Hillsboro, OR

Fatih Hamzaoglu
Intel, Hillsboro, OR

Kostas Doris
NXP, Eindhoven, The Netherlands

Masato Motomura
Tokyo Institute of Technology, Yokohama, Japan

ITPC European Regional Chair: Yiannos Manoli
University of Freiburg – IMTEK, Freiburg, Germany

ITPC European Regional Vice Chair: Tim Piessens
ICsense, Leuven, Belgium

ITPC Far East Regional Chair: Makoto Takamiya
University of Tokyo, Tokyo, Japan

ITPC Far East Regional Vice Chair: Long Yan
Samsung Electronics, Hwaseong-si, Korea

Analog Subcommittee

Chair: Kofi Makinwa
Delft University of Technology, Delft, The Netherlands

David Blaauw
University of Michigan, Ann Arbor, MI

Youngcheol Chae
Yonsei University, Seoul, Korea

Mahdi Kashmiri
Robert Bosch Research and Technology Center, Palo Alto, CA

Taeik Kim
Samsung Electronics, Gyeonggi-do, Korea

Man-Kay Law
University of Macau, Macau, China

Yiannos Manoli
University of Freiburg – IMTEK, Freiburg, Germany

Subhashish Mukherjee
Texas Instruments, Bangalore, India

Mike Perrott
Texas Instruments, Manchester, NH

Tim Piessens
ICsense, Leuven, Belgium

Wen-Chieh Wang
MediaTek, Hsinchu City, Taiwan

Data Converters Subcommittee

Chair: Michael Flynn
University of Michigan at Ann Arbor, Ann Arbor, MI

Ahmed Ali
Analog Devices, Greensboro, NC

Seyfi Bazarjani
Qualcomm Technologies, San Diego, CA

Yun Chiu
University of Texas at Dallas, Richardson, TX

Marco Corsi
Texas Instruments, Dallas, TX

Chih-Cheng Hsieh
National Tsing Hua University, Hsinchu, Taiwan

John Keane
Keysight Technologies, Santa Clara, CA

Jongwoo Lee
Samsung Electronics, Gyunggi-do, Korea

Dominique Morche
Département Architecture Conception et Logiciel Embarqué (DACLE), Grenoble Cedex, France

Takashi Oshima
Hitachi, Tokyo,Japan

Yun-Shiang Shu
Mediatek, Hsinchu City, Taiwan

Bob Verbruggen
Xilinx, Dublin, Ireland

Jan Westra
Broadcom, Bunnik, The Netherlands

Digital Architectures & Systems (DAS) Subcommittee

Chair: Thomas Burd
Advanced Micro Devices, Santa Clara, CA

Massimo Alioto
National University of Singapore, Singapore

Hsie-Chia Chang
National Chiao Tung University, HsinChu, Taiwan

Christopher Gonzalez
IBM, Yorktown Heights, NY

Wookyeong Jeong
Samsung, Gyeonggi-Do, Korea

Muhammad Khellah
Intel, Hillsboro, OR

Dejan Markovic
UCLA, Los Angeles, CA

James Myers
ARM, Cambridgeshire, United Kingdom

Hirofumi Shinohara
Waseda University, Fukuoka, Japan

Ingrid Verbauwhede
KU Leuven, Leuven, Belgium

Digital Circuits (DCT) Subcommittee

Chair: Edith Beigné
Facebook, Menlo Park, CA

Keith Bowman
Qualcomm, Raleigh, NC

Koji Hirairi
Sony LSI Design, Kanagawa, Japan

Ping-Hsuan Hsieh
National Tsing Hua University, Hsinchu City, Taiwan

Tanay Karnik
Intel, Hillsboro, OR

Alicia Klinefelter
NVidia, Durham, NC

Mijung Noh
Samsung Electronics, Gyeonggi-do, Korea

Phillip Restle
IBM T. J. Watson Research Center, Yorktown Heights, NY

Mingoo Seok
Columbia University, New York, NY

Dennis Sylvester
University of Michigan, Ann Arbor, MI

Yvain Thonnart
CEA-Leti, Grenoble, France

IMMD Subcommittee

Chair: Chris Van Hoof
imec, Leuven, Belgium

Joonsung Bae
Kangwon National University, Kangwon-do, Korea

Gert Cauwenberghs
University of California, San Diego, La Jolla, CA

Calvin Yi-Ping Chao
TSMC, Hsinchu, Taiwan

Keith Fife
4Catalyzer, Palo Alto, CA

Morris (Ming-Dou) Ker
National Chiao-Tung University, Hsinchu, Taiwan

Seong-Jin Kim
Ulsan National Institute of Science and Technology, Ulsan, Korea

Michael Kraft
KULeuven, Leuven, Belgium

Masayuki Miyamoto
Wacom, Tokyo, Japan

Pedram Mohseni
Case Western Reserve University, Cleveland, OH

Rikky Muller
University of California Berkeley, Berkeley, CA

Kazuko Nishimura
Panasonic Corporation, Moriguchi, Japan

Matteo Perenzoni
Fondazione Bruno Kessler(FBK), Trento, Italy

Bruce Rae
ST Microelectronics, Edinburgh, United Kingdom

Esther Rodriguez-Villegas
Imperial College London, London, United Kingdom

Johan Vanderhaegen
Google LLC, Mountain View, CA

Hayato Wakabayashi
Sony Semiconductor Solutions Corporation, Kanagawa, Japan

Jerald Yoo
National University of Singapore, Singapore

Machine Learning Subcommittee

Chair: Marian Verhelst
KU Leuven, Heverlee, Belguim

Andreas Burg
Telecommunications Circuits Lab @ EPFL, Lausanne, Switzerland

Geoffrey W. Burr
IBM Research, San Jose, CA

Jun Deguchi
Kioxia Corporation, Kawasaki, Japan

Yan Li
Western Digital, Milpitas, CA

Surk Hwan Lim
Samsung, Korea

Machine Learning Subcommittee (continued)

Masato Motomura
Tokyo Institute of Technology, Tokyo, Japan

Boris Murmann
Stanford University, Stanford, CA

Vivienne Sze
MIT, Cambridge, MA

Rangharajan Venkatesan
NVIDIA Corporation, Santa Clara, CA

Memory Subcommittee

Chair: Jonathan Chang
TSMC, Hsinchu, Taiwan

Seung-Jun Bae
Samsung, Gyenggi-Do, Korea

Meng-Fang Chang
National Tsing-Hua University, Hsinchu, Taiwan

Eric Karl
Intel, Portland, OR

Kyu-Hyoun (KH) Kim
IBM T.J. Watson, Yorktown Heights, NY

Dong Uk Lee
SK hynix, Gyeonggi-do, Korea

Yan Li
Western Digital, Milpitas, CA

Jongmin Park
SK Hynix, Gyeonggi-di, Korea

Ki-Tae Park
Samsung, Gyeonggi, Korea

Bor-Doou Rong
Etron

Shinichiro Shiratake
Kioxia, Yokohama,Japan

Wolfgang Spirkl
Micron Semiconductor, Munich, Germany

Yasuhiko Taito
Renesas, Tokyo, Japan

Power Management Subcommittee

Chair: Yogesh Ramadass
Texas Instruments, San Jose, CA

Min Chen
Analog Devices, Milpitas, CA

Chan-Hong Chern
TSMC, Hsinchu, Taiwan

Li Geng
Xi’an Jiaotong University, China

Yen Hsun Hsu
Mediatek,  Hsin Chu, Taiwan

Johan Janssens
ON Semiconductor, Mechelen, Belgium

Harish Krishnamurthy
Intel, Hillsboro, OR

Hoi Lee
The University of Texas at Dallas, Richardson, TX

Yan Lu
University of Macau, Taipa, Macao

Jiseon Paek
Samsung Electronics, S. Chungchung Province, Korea

Robert Pilawa
University of California – Berkeley, Berkeley, CA

Jason Stauth
Dartmouth College, Hanover, NH

Makoto Takamiya
University of Tokyo, Tokyo, Japan

Chen-Kong Teh
Toshiba Semiconductor,  Kawasaki, Japan

Gerard Villar-Pique
NXP Semiconductor,  Brabant, The Netherlands

Bernhard Wicht
University of Hannover,  Hannover, Germany

RF Subcommittee

Chair: Piet Wambacq
imec, Heverlee, Belgium

Shuhei Amakawa
Hiroshima University, Higashihiroshima, Japan

Yves Baeyens
Nokia – Bell Labs, Murray Hill, NJ

Andrea Bevilacqua
University of Padova, Padova, Italy

Jaehyouk Choi
KAIST, Daejeon, Korea

Krzysztof Dufrene
Intel, Linz, Austria

Xiang Gao
Zhejiang University, Hangzhou, China

Ramesh Harjani
University of Minnesota, Minneapolis, MN

Abbas Komijani
Apple, Mountain View, CA

Harish Krishnaswamy
Columbia University, New York, NY

Salvatore Levantino
Politecnico di Milano, Milan, Italy

John Long
University of Waterloo, Waterloo, Canada

Kohei Onizuka
Toshiba, Kanagawa,Japan

Jiayoon Ru
XINYI Information Technology, Shanghai, China

Swaminathan Sankaran
Texas Instruments, Dallas, TX

Hua Wang
Georgia Institute of Technology, Atlanta, GA

Wanghua Wu
Samsung, San Jose, CA

Conan Zhan
MediaTek, HsinChu, Taiwan

Technology Directions Subcommittee

Chair: Makoto Nagata
Kobe University, Kobe, Japan

Edoardo Charbon
EPFL, Neuchâtel, Switzerland

Frederic Gianesello
STMicroelectronics, Crolles, France

Kush Gulati
Omni Design Tech., Milpitas, CA

Tilo Meister
TU Dresden, Dresden, Germany

Patrick Mercier
University of California San Diego, San Diego, CA

Munehiko Nagatani
NTT Corporation, Kanagawa, Japan

Sudip Shekhar
University of British Columbia, Vancouver, Canada

Nick Van Helleputte
imec, Leuven, Belgium

Sriram Vangal
Intel, Hillsboro, OR

Nick Van Helleputte
imec, Leuven, Belgium

Naveen Verma
Princeton University, Princeton, NJ

Long Yan
Samsung Electronics, Hwaseong-si, Korea

Rabia Tugce Yazicigil
Boston University, Boston, MA

Xiaoyang Zeng
Fudan University, Shanghai, China

Wireless Subcommittee

Chair: Stefano Pellerano
Intel, Hillsboro, OR

Matteo Bassi
Infineon Technologies AG, Villach, Austria

Venumadhav Bhagavatula
Samsung Semiconductor, San Jose, CA

Theodoros Georgantas
Broadcom, Athens, Greece

Vito Giannini
Uhnder, Austin, TX

Xin He
NXP, Eindhoven, The Netherlands

Nagendra Krishnapura
Indian Institute of Technology Madras, Chennai, India

Yao-Hong Liu
imec, Eindhoven, The Netherlands

Howard C. Luong
Hong Kong University of Science and Technology, Kowloon, Hong Kong

Hideaki Majima
Toshiba, Kawasaki, Japan

Arun Natarajan
Oregon State University, Corvallis, OR

Sudhakar Pamarti
University of California Los Angeles (UCLA), Los Angeles, CA

Maryam Tabesh
Google, Mountain View, CA

Yiwu Tang
Qualcomm Technologies, San Diego, CA

Yuu Watanabe
Waseda University, Kanagawa, Japan

David Wentzlof
University of Michigan, Ann Arbor, MI

Renaldi Winoto
Tectus Corp, Saratoga, CA

Ken Yamamoto
Sony, Kanagawa, Japan

Wireline Subcommittee

Chair: Frank O’Mahony
Intel, Hillsboro, OR

Amir Amirkhany
Samsung Semiconductor, San Jose, CA

Tony Chan Carusone
University of Toronto, Toronto, Canada

Mike Shuo-Wei Chen
USC, Los Angeles, CA

Yohan Frans
Xilinx, San Jose, CA

Friedel Gerfers
Technische Universität Berlin, Berlin, Germany

Andrew Joy
Marvell, Irvine, CA

Byungsub Kim
Pohang University, Gyeongsangbukdo, Korea

Mounir Meghelli
IBM ThomasJ Watson Research Center, Yorktown Heights, NY

Sam Palermo
Texas A&M University, College Station, TX

Takashi Takemoto
Hokkaido University, Hokkaido, Japan

Thomas Toifl
Cisco Systems, Wallisellen, Switerzland

Bo Zhang
Broadcom Limited, Irvine, CA