CICC

2022 Technical Committees

Technical Editors

Jason H. Anderson
University of Toronto, Toronto, Canada

Leonid Belostotski
The University of Calgary, Calgary, Canada

Dustin Dunwell
Alphawave IP, Toronto, Canada

Vincent Gaudet
University of Waterloo,Waterloo, Canada

Glenn Gulak
University of Toronto, Toronto, Canada

James W. Haslett
The University of Calgary, Calgary, Canada

Shahriar Mirabbasi
University of British Columbia, Vancouver, Canada

Multi-Media Coordinator and Digest Editor

David Halupka
StarIC, Toronto, Canada

Program Chair

Edith Beigné
Facebook, Menlo Park, CA

Program Vice-Chair

Piet Wambacq
imec, Heverlee, Belgium

ITPC European Regional Chair: Bruce Rae
ST Microelectronics Imaging Division, Edinburgh, United Kingdom

ITPC European Regional Vice Chair: Bernhard Witch
University of Hannover, Hannover, Germany

ITPC Far East Regional Chair: Yun-Shiang Shu
MediaTek, Hsinchu City, Taiwan

ITPC Far East Regional Vice Chair: Jun Deguchi
Kioxia Corporation, Kawasaki, Japan

Analog Subcommittee

Chair: Maurits Ortmanns
Institute of Microelectronics, University of Ulm, Ulm, Germany

Jens Anders
University of Stuttgart, Stuttgart, Germany

Marco Berkhout
Goodix Technology

David Blaauw
University of Michigan, Ann Arbor, MI

Youngcheol Chae
Yonsei University, Seoul, Korea

Qinwen Fan
Delft University of Technology, Delft, The Netherlands

Drew Hall
University of California, San Diego, La Jolla, CA

Mahdi Kashmiri
Broadcom, San Jose, CA

Taeik Kim
Samsung Electronics, Gyeonggi-do, Korea

Man-Kay Law
University of Macau, Macau, China

Viola Schafer
Texas Instruments, Freising, Germany

Shon-Hang Wen
MediaTek, Hsinchu City, Taiwan

Jiawei Xu
Fudan University, Shanghai, China

Data Converters Subcommittee

Chair: Michael Flynn
University of Michigan at Ann Arbor, Ann Arbor, MI

Ahmed Ali
Analog Devices, Greensboro, NC

Seyfi Bazarjani
Qualcomm Technologies, San Diego, CA

Yun Chiu
University of Texas at Dallas, Richardson, TX

Ping Gui
Southern Methodist University, Dallas, TX

Chih-Cheng Hsieh
National Tsing Hua University, Hsinchu, Taiwan

John Keane
Keysight Technologies, Santa Clara, CA

Jongwoo Lee
Samsung Electronics, Gyunggi-do, Korea

Dominique Morche
Département Architecture Conception et Logiciel Embarqué (DACLE), Grenoble Cedex, France

Yun-Shiang Shu
Mediatek, Hsinchu City, Taiwan

Jan Westra
Broadcom, Bunnik, The Netherlands

Yan Zhu
University of Macau, Macau, China

Digital Architectures & Systems (DAS) Subcommittee

Chair: Thomas Burd
Advanced Micro Devices, Santa Clara, CA

Massimo Alioto
National University of Singapore, Singapore

Shidhartha Das
Arm, Cambridge, United Kingdom

Chiraag Juvekar
Analog Devices, Boston, MA

Hugh Mair
MediaTek, Austin, TX

Sanu Mathew
Intel, Hillsboro, OR

Sugako Otani
Renesas Electronics, Tokyo, Japan

Rahul Rao
IBM India, Bangalore, India

Ingrid Verbauwhede
KU Leuven, Leuven, Belgium

Chia-Hsiang Yang
National Taiwan University, Taipei, Taiwan

Digital Circuits (DCT) Subcommittee

Chair: Keith Bowman
Qualcomm, Raleigh, NC

Eric Jia-Wei Fang
Mediatek, Hsinchu City, Taiwan

Ping-Hsuan Hsieh
National Tsing Hua University, Hsinchu City, Taiwan

Tanay Karnik
Intel, Hillsboro, OR

Alicia Klinefelter
NVidia, Durham, NC

Huichu Liu
Facebook Agile Silicon Team (FAST), Menlo Park, CA

Mijung Noh
Samsung Electronics, Gyeonggi-do, Korea

Arijit Raychowdhury
Georgia Institute of Technology, Atlanta, GA

Mingoo Seok
Columbia University, New York, NY

Yvain Thonnart
CEA-Leti, Grenoble, France

IMMD Subcommittee

Chair: Chris Van Hoof
imec, Leuven, Belgium

Joonsung Bae
Kangwon National University, Kangwon-do, Korea

Jun-Chau Chien
Taiwan

Sohmyung Ha
New York, NY

Mutsumi Hamaguchi
Japan

Mehdi Kiani
Pennsylvania State University, State College, PA

Seong-Jin Kim
Ulsan National Institute of Science and Technology, Ulsan, Korea

Junghyup Lee
DGIST, Daegu, Korea

Jennifer Lloyd
Analog Devices, San Jose, CA

Rikky Muller
University of California Berkeley, Berkeley, CA

Kazuko Nishimura
Panasonic Corporation, Moriguchi, Japan

Matteo Perenzoni
Fondazione Bruno Kessler(FBK), Trento, Italy

Bruce Rae
ST Microelectronics, Edinburgh, United Kingdom

Esther Rodriguez-Villegas
Imperial College London, London, United Kingdom

Masaki Sakakibara
Sony, Japan

Vyshnavi (Vyshi) Suntharalingam
MIT Lincoln Laboratory, Lexington, MA

Johan Vanderhaegen
Google LLC, Mountain View, CA

Jerald Yoo
National University of Singapore, Singapore

Machine Learning Subcommittee

Chair: Marian Verhelst
KU Leuven, Heverlee, Belguim

Luca Benini
ETHZ and UNIBO ETZ, Zurich, Switzerland

Geoffrey W. Burr
IBM Research, San Jose, CA

Jun Deguchi
Kioxia Corporation, Kawasaki, Japan

Surk Hwan Lim
Samsung, Korea

Yongpan Liu
Tsinghua University, Beijing, China

Jae-sun Seo
Arizona State University, Tempe, AZ

Sophia Shao
UC Berkeley, Berkeley, CA

Kea-Tiong (Samuel) Tang
National Tsing Hua University, Hsinchu, Taiwan

Rangharajan Venkatesan
NVIDIA Corporation, Santa Clara, CA

Memory Subcommittee

Chair: Meng-Fan Chang
National Tsing Hua University, Hsinchu, Taiwan

Ru Huang
Peking University, Beijing, China

Eric Karl
Intel, Portland, OR

Hye-Ran Kim
Samsung Electronics, Gyeonggi-do, Korea

Kyu-Hyoun (KH) Kim
IBM T.J. Watson, Yorktown Heights, NY

Dong Uk Lee
SK hynix, Gyeonggi-do, Korea

Seung-Jae Lee
Samsung, Gyeonggi-do, Korea

Violante Moschiano
Micron, Avezzano (AQ), Italy

Bor-Doou Rong
Etron, Hsinchu, Taiwan

Hidehiro Shiga
KIOXIA, Yokohama,Japan

Yasuhiko Taito
Renesas, Tokyo, Japan

Eric Wang
TSMC, Hsinchu, Taiwan

Power Management Subcommittee

Chair: Yogesh Ramadass
Texas Instruments, San Jose, CA

Patrik Arno
ST Microelectronics, Sassenage, France

Ke-Horng Chen
National Chiao Tung University, Hsinchu, Taiwan

Min Chen
Analog Devices, Santa Clara, CA

Chan-Hong Chern
TSMC, Hsinchu, Taiwan

Li Geng
Xi’an Jiaotong University, China

Kuo-Chun Hsu
MediaTek, Hsinchu, Taiwan

Johan Janssens
ON Semiconductor, Mechelen, Belgium

Harish Krishnamurthy
Intel, Hillsboro, OR

Xun Liu
Chinese University of Hong Kong, Guangdong, Hong Kong

Yan Lu
University of Macau, Taipa, Macao

Kosuke Miyaji
Shinshu University, Nagano, Japan

Jiseon Paek
Samsung Electronics, S. Chungchung Province, Korea

Gael Pillonnet
CEA-Léti, Grenoble, France

Robert Pilawa
University of California – Berkeley, Berkeley, CA

Jason Stauth
Dartmouth College, Hanover, NH

Chen-Kong Teh
Toshiba Semiconductor,  Kawasaki, Japan

Bernhard Wicht
University of Hannover,  Hannover, Germany

Xin Zhang
IBM T. J. Watson Research Center,  Yorktown Heights, NY

RF Subcommittee

Chair: Jan Craninckx
IMEC, Leuven, Belgium

Shuhei Amakawa
Hiroshima University, Higashihiroshima, Japan

Masoud Babaie
Delft University of Technology, Zuid-Holland, The Netherlands

Yves Baeyens
Nokia – Bell Labs, Murray Hill, NJ

James Buckwalter
University of California Santa Barbara, Santa Barbara, CA

Jaehyouk Choi
KAIST, Daejeon, Korea

Wei Deng
Tsinghua University, Beijing, China

Jeremy Dunworth
Qualcomm Technologies, San Diego, CA

Ramesh Harjani
University of Minnesota, Minneapolis, MN

Shuya Kishimoto
MIRISE Technologies, Tokyo, Japan

Salvatore Levantino
Politecnico di Milano, Milan, Italy

Patrick Reynaert
KU Leuven, Leuven, Belgium

Swaminathan Sankaran
Texas Instruments, Dallas, TX

Jeff Walling
Virginia Tech, Blacksburg, VA

Hua Wang
Georgia Institute of Technology, Atlanta, GA

Wanghua Wu
Samsung, San Jose, CA

Hongtao Xu
Fudan University, Shanghai, China

Jun Yin
University of Macau, Taipa, Macau, China

Conan Zhan
MediaTek, HsinChu, Taiwan

Technology Directions Subcommittee

Chair: Makoto Nagata
Kobe University, Kobe, Japan

Radu Berdan
Kioxia, Kawasaki, Japan

Denis Daly
Apple, Wellesley, MA

Frederic Gianesello
STMicroelectronics, Crolles, France

Shawn Shuo-Hung Hsu
National Tsing Hua University, Hsinchu, Taiwan

Patrick Mercier
University of California San Diego, San Diego, CA

Carolina Mora-Lopezi
Imec, Leuven, Belgium

Daniel H. Morris
Facebook, Menlo Park, CA

Munehiko Nagatani
NTT Corporation, Kanagawa, Japan

Fabio Sebastiano
Delft University of Technology, Delft, The Netherlands

Sudip Shekhar
University of British Columbia, Vancouver, Canada

Sriram Vangal
Intel, Hillsboro, OR

Rabia Tugce Yazicigil
Boston University, Boston, MA

Milin Zhang
Tsinghua University, Beijing, China

Wireless Subcommittee

Chair: Stefano Pellerano
Intel, Hillsboro, OR

Matteo Bassi
Infineon Technologies AG, Villach, Austria

Venumadhav Bhagavatula
Samsung Semiconductor, San Jose, CA

Yuan-Hung Chung
MediaTek, Hsinchu, Taiwan

Vito Giannini
Uhnder, Austin, TX

Giuseppe Gramegna
IMEC, Leuven, Belgium

Jane Gu
University of California Davis, Davis, CA

Hiroyuki Ito
Tokyo Institute of Technology, Yokohama, Japan

Nagendra Krishnapura
Indian Institute of Technology Madras, Chennai, India

Byung-Wook Min
Yonsei University, Seoul, Korea

Jan Prummel
Dialog Semiconductor, MV‘s-Hertogenbosch, The Netherlands

Negar Reiskarimia
Massachusetts Institute of Technology (MIT), Cambridge, MA

Bodhisatwa Sadhu
IBM T. J. Watson Research Center, Yorktown Heights, NY

Shahriar Shahramian
Nokia – Bell Labs, New Providence, NJ

Ho-Jin Song
Pohang University of Science and Technology, Gyeongbuk, Korea

Maryam Tabesh
Google, Mountain View, CA

Yiwu Tang
Qualcomm Technologies, San Diego, CA

David Wentzlof
University of Michigan, Ann Arbor, MI

Wireline Subcommittee

Chair: Yohan Frans
Xilinx, San Jose, CA

Amir Amirkhany
Samsung Semiconductor, San Jose, CA

Mike Shuo-Wei Chen
USC, Los Angeles, CA

Wei-Zen Chen
National Yang Ming Chiao Tung University (NYCU), Hsin-Chu, Taiwan

Friedel Gerfers
Technische Universität Berlin, Berlin, Germany

Masum Hossain
University of Alberta, Edmonton, Canada

Byungsub Kim
Pohang University, Gyeongsangbukdo, Korea

Mozhgan Mansuri
Intel, Hillsboro, OR

Takashi Takemoto
Hokkaido University, Hokkaido, Japan

Thomas Toifl
Cisco Systems, Wallisellen, Switerzland

C. Patrick Yue
Hong Kong University of Science and Technology, Clear Water Bay, Hong Kong

Bo Zhang
Broadcom Limited, Irvine, CA