CICC

ISSCC Committees

2022 Executive & Regional Committees

Conference Chair

Kevin Zhang
Taiwan Semiconductor Manufacturing Company, Hsinchu, Taiwan

Past Conference Chair

Jan van der Spiegel
University of Pennsylvania, Philadelphia, PA

Senior Technical Advisor

Anantha Chandrakasan
Massachusetts Institute of Technology, Cambridge, MA

Executive Committee Secretary, Demo Session Chair

Eugenio Cantatore
Eindhoven University of Technology, Eindhoven, The Netherlands

Press Coordinator

Shahriar Mirabbasi
University of British Columbia, Vancouver, Canada

SRP Chair

Jerald Yoo
National University of Singapore, Singapore

Web Site & A/V Chair

Trudy Stetzler
Halliburton, Houston, TX

Director of Finance

John Weinmann
Rochester, NY

Program Chair

Edith Beigné
Facebook. Menlo Park, CA

Program Vice-Chair

Piet Wambacq
imec, Heverlee, Belgium

WIC,  Industry Showcase Representative

Alice Wang
psikick, Plano, TX

ITPC Far East Regional Chair

Yun-Shiang Shu
MediaTek, Hsinchu City, Taiwan

ITPC Far East Regional Vice-Chair

Jun Deguchi
Kioxia Corporation, Kawasaki, Japan

ITPC European Regional Chair

Bruce Rae
ST Microelectronics, Edinburgh, United Kingdom

ITPC European Regional Vice-Chair

Bernhard Witch
University of Hannover, Hannover, Germany

Adcom Representative

Bryan Ackland
Old Bridge, NJ

Director of Publications

Laura Fujino
University of Toronto, Toronto, Canada

Press Liaison & ARC Chair

Kenneth C. Smith
University of Toronto, Toronto, Canada

Education Chair

Ali Sheikholeslami
University of Toronto, Toronto, Canada

Director of Operations

Melissa Widerkehr
Widerkehr and Associates, Lewes, DE

European Regional Subcommittee

ITPC European Regional Chair

Bruce Rae
ST Microelectronics, Edinburgh, United Kingdom

ITPC European Regional Vice-Chair

Bernhard Witch
University of Hannover, Hannover, Germany

ITPC European Regional Secretary

Matteo Bassi
Infineon Technologies AG, Villach, Austria

Jens Anders
University of Stuttgart, Stuttgart, Germany

Patrik Arno
ST Microelectronics, Sassenage, France

Masoud Babaie
Delft University of Technology, Zuid-Holland, The Netherlands

Matteo Bassi
Infineon Technologies AG, Villach, Austria

Luca Benini
ETHZ and UNIBO, Zurich, Switzerland

Marco Berkhout
Goodix Technology, Nijmegen, The Netherlands

Jan Craninckx
IMEC, Leuven, Belgium

Shidhartha Das
Arm, Cambridge, United Kingdom

Qinwen Fan
Delft University of Technology, Delft, The Netherlands

Friedel Gerfers
Technische Universität Berlin, Berlin, Germany

Frederic Gianesello
STMicroelectronics, Crolles, France

Giuseppe Gramegna
IMEC, Leuven, Belgium

Chris Van Hoof
imec, Leuven, Belgium

Johan Janssens
ON Semiconductor, Mechelen, Belgium

Salvatore Levantino
Politecnico di Milano (POLIMI), Milano, Italy

Carolina Mora-Lopez
imec, Leuven, Belgium

Dominique Morche
Département Architecture Conception et Logiciel Embarqué (DACLE), Grenoble Cedex, France

Violante Moschiano
Micron, Avezzano (AQ), Italy

Maurits Ortmanns
University of Ulm, Ulm, Germany

Matteo Perenzoni
Fondazione Bruno Kessler (FBK), Trento, Italy

Gael Pillonnet
CEA-Léti, Grenoble, France

Jan Prummel
Dialog Semiconductor, MV ‘s-Hertogenbosch, The Netherlands

Patrick Reynaert
KU Leuven, Leuven, Belgium

Esther Rodriguez-Villegas
Imperial College London, London, United Kingdom

Viola Schafer
Texas Instruments, Freising, Germany

Fabio Sebastiano
Delft University of Technology, Delft, The Netherlands

Yvain Thonnart
CEA-Leti, Grenoble, France

Thomas Toifl
Cisco Systems, Wallisellen. Switzerland

Ingrid Verbauwhede
KU Leuven, Leuven, Belgium

Marian Verhelst
KU Leuven, Heverlee, Belgium

Jan Westra
Broadcom, Bunnik, The Netherlands

Far East Regional Subcommittee

ITPC Far East Regional Chair

Yun-Shiang Shu
Mediatek, Hsinchu City, Taiwan

ITPC Far East Regional Vice-Chair

Jun Deguchi
Kioxia Corporation, Kawasaki, Japan

ITPC Far East Regional Secretary

Man-Kay Law
University of Macau, Taipa, Macau, China

ITPC Far East Regional Associate Secretary

Jaehyouk Choi
KAIST, Daejeon, Korea

Massimo Alioto
National University of Singapore, Singapore

Shuhei Amakawa
Hiroshima University, Japan

Joonsung Bae
Kangwon National University, Kangwon-do, Korea

Radu Berdan
Kioxia, Kawasaki, Japan

Youngcheol Chae
Yonsei University, Seoul, Korea

Meng-Fang Chang
National Tsing-Hua University, Hsinchu, Taiwan

Ke-Horng Chen
National Chiao Tung University, Hsinchu, Taiwan

Wei-Zen Chen
National Yang Ming Chiao Tung University (NYCU), Hsin-Chu, Taiwan

Chan-Hong Chern
TSMC, Hsinchu, Taiwan

Jun-Chau Chien
Taiwan

Jaehyouk Choi
KAIST, Yuseong-gu Daejeon, Korea

Yuan-Hung Chung
MediaTek, Hsinchu, Taiwan

Wei Deng
Tsinghua University, Beijing, China

Eric Jia-Wei Fang
MediaTek, Hsinchu, Taiwan

Li Geng
Xi’an Jiaotong University, Shaanxi, China

Mutsumi Hamaguchi
Japan

Chih-Cheng Hsieh
National Tsing Hua University, Hsinchu, Taiwan

Ping-Hsuan Hsieh
National Tsing Hua University, Hsinchu City, Taiwan

Kuo-Chun Hsu
MediaTek, HsinChu, Taiwan

Shawn Shuo-Hung Hsu
National Tsing Hua University, Hsinchu, Taiwan

Ru Huang
Peking University, Beijing, China

Hiroyuki Ito
Tokyo Institute of Technology, Yokohama, Japan

Byungsub Kim
Pohang University of Science and Technology, Korea

Hye-Ran Kim
Samsung Electronics, Gyeonggi-do, Korea

Seong-Jin Kim
Ulsan National Institute of Science and Technology, Ulsan, Korea

Taeik Kim
Samsung Electronics, Gyeonggi-do, Korea

Shuya Kishimoto
MIRISE Technologies, Tokyo, Japan

Nagendra Krishnapura
Indian Institute of Technology Madras, Chennai, India

Man-Kay Law
University of Macau, Macau, China

Dong Uk Lee
SK hynix, Gyeonggi-do, Korea

Jongwoo Lee
Samsung Electronics, Hwasung-si Gyunggi-do, Korea

Junghyup Lee
DGIST, Daegu, Korea

Seung-Jae Lee
Samsung, Gyeonggi-do, Korea

SurkHwan Lim
Samsung, Korea

Xun Liu
Chinese University of Hong Kong, Hong Kong

Yongpan Liu
Tsinghua University, Beijing, China

Yan Lu
University of Macau, Taipa, Macao

Byung-Wook Min
Yonsei University, Seoul, Korea

Kousuke Miyaji
Shinshu University, Nagano, Japan

Makoto Nagata
Kobe University, Kobe, Japan

Munehiko Nagatani
NTT Corporation, Kanagawa, Japan

Kazuko Nishimura
Panasonic Corporation, Moriguchi, Japan

Mijung Noh
Samsung Electronics, Gyeonggi-do, Korea

Sugako Otani
Renesas Electronics, Tokyo, Japan

Jiseon Paek
Samsung Electronics, S. Chungchung Province, Korea

Rahul Rao
IBM, Bangalore, India

Bor-Doou Rong
Etron, Hsinchu, Taiwan

Masaki Sakakibara
Japan

Hidehiro Shiga
KIOXIA, Yokohama, Japan

Ho-Jin Song
Pohang University of Science and Technology, Gyeongbuk, Korea

Yasuhiko Taito
Renesas, Tokyo, Japan

Takashi Takemoto
Hokkaido University, Hokkaido, Japan

Kea-Tiong (Samuel) Tang
National Tsing Hua University, Hsinchu, Taiwan

Chen-Kong Teh
Toshiba Semiconductor, Kawasaki, Japan

Eric Wang
TSMC, Hsinchu, Taiwan

Shon-Hang Wen
MediaTek, Hsinchu City, Taiwan

Jiawei Xu
Fudan University, Shanghai, China

Hongtao Xu
Fudan University, Shanghai, China

Chia-Hsiang Yang
National Taiwan University, Taipei, Taiwan

Jun Yin
University of Macau, Taipa, Macau, China

Jerald Yoo
National University of Singapore, Singapore

Patrick Yue
Hong Kong University of Science and Technology, Clear Water Bay, Hong Kong

Conan Zhan
MediaTek, HsinChu, Taiwan

Milin Zhang
Tsinghua University, Beijing, China

Yan Zhu
University of Macau, Taipa, Macau, China