CICC

Committees

2018 Executive & Regional Committees

Conference Chair

Anantha Chandrakasan
Massachusetts Institute of Technology, Cambridge, MA

Executive Committee Secretary, Data Team, SRP Chair

SeongHwan Cho
KAIST, Daejeon, Korea

Press Coordinator

Denis Daly
Omni Design Technologies

Web Site & A/V Chair

Trudy Stetzler
Houston, TX

Director of Finance & Book Display Coordinator

Bryant Griffin
Penfield, NY

Program Chair

Alison Burdett
Sensium Healthcare, Oxfordshire, United Kingdom

Program Vice-Chair

Eugenio Cantatore
Eindhoven University of Technology, Eindhoven, The Netherlands

Demonstration Session Chair

Uming Ko
MediaTek, Austin, TX

Adcom Representative & Alumni Event Coordinator

Jan van der Spiegel
University of Pennsylvania, Philadelphia, PA

ITPC Far East Regional Chair

Sungdae Choi
SK Hynix Semiconductor, Icheon, Korea

ITPC Far East Regional Vice-Chair

Tai-Cheng Lee
National Taiwan University, Taipei, Taiwan

ITPC European Regional Chair

Marian Verhelst
KU Leuven, Heverlee, Belgium

ITPC European Regional Vice-Chair

Kostas Doris
NXP, Eindhoven, The Netherlands

Adcom Representative

Bryan Ackland
Stevens Institute of Technology, Hoboken, NJ

Director of Publications

Laura Fujino
University of Toronto, Toronto, Canada

Press Liaison & ARC Chair

Kenneth C. Smith
University of Toronto, Toronto, Canada

Forums Chair

Andreia Cathelin
STMicroelectronics, Crolles, France

Education Chair (Short Course – Tutorials)

Ali Sheikholeslami
University of Toronto, Toronto, Canada

Director of Operations

Melissa Widerkehr
Widerkehr and Associates, Montgomery Village, MD

European Regional Subcommittee

ITPC European Regional Chair

Marian Verhelst
KU Leuven, Heverlee, Belgium

ITPC European Regional Vice-Chair

Kostas Doris
NXP, Eindhoven, The Netherlands

ITPC European Regional Secretary

Yiannos Manoli
University of Freiburg – IMTEK, Freiburg, Germany

Edith Beigné
CEA-LETI, Grenoble, France

Andrea Bevilacqua
University of Padova, Padova, Italy

Andrea Bevilacqua
University of Padova, Padova, Italy

Pierre Busson
ST Microelectronics, Crolles, France

Edoardo Charbon
TU Delft & EPFL, Delft, The Netherlands

Wim Dehaene
Kuleuven-MICAS, Leuven, Belgium

Krzysztof Dufrene
Intel, Linz, Austria

Antoine Dupret
CEA Saclay Nano-INNOV, Gif-sur-Yvette, France

Simone Erba
STMicroelectronics, Pavia, Italy

Jan Genoe
imec, Leuven,Belgium

Theodoros Georgantas
Broadcom, Athens, Greece

Frederic Gianesello
STMicroelectronics, France

Giuseppe Gramegna
Huawei, Mougins, France

Pieter Harpe
Eindhoven University of Technology, Eindhoven, The Netherlands

Xin He
NXP, Eindhoven, The Netherlands

Andrew Joy
Cavium, Northamptonshire, United Kingdom

Michael Kraft
Montefiore Institute University of Liege, Liege, Belgium

Stéphane Le Tual
STmicroelectronics, Crolles, France

Yao-Hong Liu
imec, Eindhoven, The Netherlands

Kofi Makinwa
Delft University of Technology, Delft, The Netherlands

Andrea Mazzanti
University of Pavia, Pavia, Italy

James Myers
ARM, Cambridgeshire, United Kingdom

Roberto Nonis
Infineon, Villach, Austria

Matteo Perenzoni
Fondazione Bruno Kessler Center, Povo, Italy

Tim Piessens

ICsense, Leuven, Belgium

Gerard Villar Pique
NXP Semiconductors, Eindhoven, The Netherlands

Esther Rodriguez-Villegas
Imperial College London, London, United Kingdom

Joseph Shor
Bar Ilan University, Ramat Gan, Israel

Wolfgang Spirkl
Micron Semiconductor, Munich, Germany

Stefano Stanzione
imec-NL, Eindhoven, The Netherlands

Nick Van Helleputte
imec, Leuven, Belgium

Ingrid Verbauwhede
KU Leuven, Leuven, Belgium

Bob Verbruggen
Xilinx, Dublin, Ireland

Piet Wambacq
imec, Heverlee, Belgium

Jan Westra
Broadcom, Bunnik, The Netherlands

Bernhard Wicht
Institute of Microelectronic Systems, Hannover, Germany

Alan Chi-Wai Wong
EnSilica, Oxfordshire, United Kingdom

Far East Regional Subcommittee

ITPC Far East Regional Chair

Sungdae Choi
SK Hynix Semiconductor, Icheon, Korea

ITPC Far East Regional Vice-Chair

Tai-Cheng Lee
National Taiwan University, Taipei, Taiwan

ITPC Far East Regional Secretary

Makoto Takamiya
University of Tokyo, Tokyo, Japan

Hyeon-Min Bae
KAIST, Daejong, Korea

Seung-Jun Bae
Samsung, Hwasung, Korea

Youngcheol Chae
Yonsei University, Seoul, Korea

Jonathan Chang
TSMC, Hsinchu, Taiwan

Hsie-Chia Chang
National Chiao Tung University, HsinChu, Taiwan

Meng-Fang Chang
National Tsing-Hua University, Hsinchu, Taiwan

Calvin Yi-Ping Chao
TSMC, Hsinchu, Taiwan

Jaehyouk Choi
Ulsan National Institute of Science Technology, Ulsan, Korea

Yoon-Kyung Choi
Samsung, Hwaseong, Korea

Jun Deguchi
Toshiba, Kawasaki,Japan

Minoru Fujishima
Hiroshima University, Higashi-hiroshima,Japan

Hiroshi Fuketa
AIST, Ibaraki,Japan

Yuan Gao
IME, A*STAR, Singapore

Chun-Huat Heng
National University of Singapore, Singapore

Koji Hirairi
Sony LSI Design, Kanagawa, Japan

Zhiliang Hong
Fudan University, Shanghai, China

Yen Hsun Hsu
Mediatek, Hsinchu, Taiwan

Chih-Ming Hung
MediaTek, Taipei, Taiwan

Makoto Ikeda
University of Tokyo, Tokyo,Japan

Wookyeong Jeong
Samsung, Hwaseong, Korea

Jaeha Kim
Seoul National University, Seoul, Korea

Taeik Kim
Samsung Electronics, Gyeonggi-do, Korea

Takashi Kono
Renesas, Tokyo, Japan

Tai-Haur Kuo
National Cheng Kung University, Tainan, Taiwan

Man-Kay Law
University of Macau, Macau, China

Dong Uk Lee
SK hynix, Gyeonggi-do, Korea

Kyoo Hyun Lim
FCI, Seongnam-si, Korea

Howard C.Luong
Hong Kong University of Science and Technology, Kowloon, Hong Kong

Hideaki Majima
Toshiba, Kawasaki, Japan

Pui-In Mak
University of Macau, Taipa, Macau

Mahesh Mehendale
Texas Instruments, Bangalore, India

Masayuki Miyamoto
Sharp, Nara,Japan

Masato Motomura
Hokkaido University, Sapporo,Japan

Shuichi Nagai
Panasonic, Osaka,Japan

Makoto Nagata
Kobe University, Kobe,Japan

Byeong-Gyu Nam
Chungnam National University, Daejeon, Korea

Kohei Onizuka
Toshiba, Kawasaki,Japan

Takashi Oshima
Hitachi, Tokyo,Japan

Ki-Tae Park
Samsung, Hwaseong, Korea

Seung-Tak Ryu
KAIST, Daejeon, Korea

Chun Shiah
Etron, Hsinchu, Taiwan

Takayuki Shibasaki
Fujitsu Laboratories, Kawasaki,Japan

Yasuhisa Shimazaki
Renesas, Tokyo,Japan

Hyunchol Shin
Kwangwoon University, Seoul, Korea

Youngmin Shin
Samsung, Hwansung, Korea

Hirofumi Shinohara
Waseda University, Fukuoka, Japan

Shinichiro Shiratake
Toshiba, Yokohama, Japan

Yun-Shiang Shu
Mediatek, Hsinchu City, Taiwan

Makoto Takamiya
University of Tokyo, Tokyo, Japan

Seng-Pan (Ben) U
University of Macau, Taipa, Macau

Ping-Ying Wang
CMOS-Crystal, Hsinchu, Taiwan

Yuu Watanabe
Denso Corporation, Tokyo,Japan

Peter Chung-Yu Wu
National Chiao Tung University, Hsinchu, Taiwan

Yong Ping Xu
National University of Singapore, Singapore

Ken Yamamoto
Sony, Kanagawa, Japan

Long Yan
Samsung Electronics, Hwaseong, Korea

Young-Sub Yuk
SK Hynix, Gyeonggi-do, Korea