CICC

ISSCC Committees

2020 Executive & Regional Committees

Conference Chair

Jan van der Spiegel
University of Pennsylvania, Philadelphia, PA

Senior Technical Advisor

Anantha Chandrakasan
Massachusetts Institute of Technology, Cambridge, MA

Conference Chair Elect

Kevin Zhang
Taiwan Semiconductor Manufacturing Company, Hsinchu, Taiwan

Executive Committee Secretary, Data Team, SRP Chair, Press Coordinator

Denis Daly
Omni Design Technologies

Web Site & A/V Chair

Trudy Stetzler
Halliburton, Houston, TX

Director of Finance & Book Display Coordinator

John Weinmann
Rochester, NY

Program Chair

Un-Ku Moon
Oregon State University, Corvallis, OR

Program Vice-Chair

Makoto Ikeda
University of Tokyo, Tokyo, Japan

Demonstration Session Chair

Eugenio Cantatore
Eindhoven University of Technology, Eindhoven, The Netherlands

WIC,  Industry Showcase Representative

Alice Wang
psikick, Santa Clara, CA

ITPC Far East Regional Chair

Makoto Takamiya
University of Tokyo, Tokyo, Japan

ITPC Far East Regional Vice-Chair

Long Yan
Samsung Electronics, Hwaseong-si, Korea

ITPC European Regional Chair

Yiannos Manoli
University of Freiburg – IMTEK, Freiburg, Germany

ITPC European Regional Vice-Chair

Tim Piessens
ICsense, Leuven, Belgium

Adcom Representative

Bryan Ackland
Old Bridge, NJ

Director of Publications

Laura Fujino
University of Toronto, Toronto, Canada

Press Liaison & ARC Chair

Kenneth C. Smith
University of Toronto, Toronto, Canada

Forums Chair

Andreia Cathelin
STMicroelectronics, Crolles Cedex, France

Education Chair (Short Course – Tutorials)

Ali Sheikholeslami
University of Toronto, Toronto, Canada

Director of Operations

Melissa Widerkehr
Widerkehr and Associates, Montgomery Village, MD

European Regional Subcommittee

ITPC European Regional Chair

Yiannos Manoli
University of Freiburg – IMTEK, Freiburg, Germany

ITPC European Regional Vice-Chair

Tim Piessens
ICsense, Leuven, Belgium

ITPC European Regional Secretary

Bruce Rae
ST Microelectronics, Edinburgh, United Kingdom

Matteo Bassi
Infineon Technologies AG, Villach, Austria

Luca Benini
ETHZ and UNIBO, Zürich, Switzerland

Andrea Bevilacqua
University of Padova, Padova, Italy

Edoardo Charbon
TU Delft & EPFL, Delft, The Netherlands

Krzysztof Dufrene
Intel, Linz, Austria

Theodoros Georgantas
Broadcom, Athens, Greece

Friedel Gerfers
Technische Universität Berlin, Berlin, Germany

Frederic Gianesello
STMicroelectronics, Crolles, France

Xin He
NXP, Eindhoven, The Netherlands

Johan Janssens
ON Semiconductor, Belgium

Andrew Joy
Marvell, Northamptonshire, United Kingdom

Michael Kraft
KULeuven, Leuven, Belgium

Salvatore Levantino
Politecnico di Milano (POLIMI), Milan, Italy

Yao-Hong Liu
imec, Eindhoven, The Netherlands

Kofi Makinwa
Delft University of Technology, Delft, The Netherlands

Tilo Meister
TU Dresden, Dresden, Germany

Dominique Morche
Département Architecture Conception et Logiciel Embarqué (DACLE), Grenoble Cedex, France

James Myers
ARM Ltd, Cambridge, United Kingdom

Matteo Perenzoni
Fondazione Bruno Kessler (FBK), Povo, Italy

Esther Rodriguez-Villegas
Imperial College London, London, United Kingdom

Wolfgang Spirkl
Micron Semiconductor, Munich, Germany

Yvain Thonnart
CEA-Leti, Grenoble, France

Thomas Toifl
Cisco Systems, Wallisellen. Switzerland

Nick Van Helleputte
imec, Leuven, Belgium

Chris Van Hoof
imec, Leuven, Belgium

Ingrid Verbauwhede
KU Leuven, Leuven, Belgium

Bob Verbruggen
Xilinx, Dublin, Ireland

Marian Verhelst
KU Leuven, Heverlee, Belgium

Gerard Villar-Pique
NXP Semiconductor, Brabant, The Netherlands

Piet Wambacq
imec, Heverlee, Belgium

Jan Westra
Broadcom, Bunnik, The Netherlands

Bernhard Wicht
Institute of Microelectronic Systems, Hannover, Germany

Far East Regional Subcommittee

ITPC Far East Regional Chair

Makoto Takamiya
University of Tokyo, Tokyo, Japan

ITPC Far East Regional Vice-Chair

Long Yan
Samsung Electronics, Hwaseong-si, Korea

ITPC Far East Regional Secretary

Yun-Shiang Shu
Mediatek, Hsinchu City, Taiwan

Massimo Alioto
National University of Singapore, Singapore

Shuhei Amakawa
Hiroshima University, Japan

Joonsung Bae
Kangwon National University, Kangwon-do, Korea

Seung-Jun Bae
Samsung, Hwasung, Korea

Youngcheol Chae
Yonsei University, Seoul, Korea

Hsie-Chia Chang
National Chiao Tung University, HsinChu, Taiwan

Jonathan Chang
TSMC, Hsinchu, Taiwan

Meng-Fang Chang
National Tsing-Hua University, Hsinchu, Taiwan

Calvin Yi-Ping Chao
TSMC, Hsinchu, Taiwan

Chan-Hong Chern
TSMC, Hsinchu, Taiwan

Jaehyouk Choi
Ulsan National Institute of Science Technology, Ulsan, Korea

Jun Deguchi
Kioxia Corporation, Kawasaki, Japan

Xiang Gao
Zhejiang University, Zhejiang, China

Li Geng
Xi’an Jiaotong University, Shaanxi, China

Koji Hirairi
Sony LSI Design, Kanagawa, Japan

Chih-Cheng Hsieh
National Tsing Hua University, Hsinchu, Taiwan

Ping-Hsuan Hsieh
National Tsing Hua University, Hsinchu City, Taiwan

Yen-Hsun Hsu
Mediatek, HsinChu, Taiwan

Wookyeong Jeong
Samsung, Gyeonggi-Do, Korea

Morris (Ming-Dou) Ker
National Chiao-Tung University, Hsinchu, Taiwan

Byungsub Kim
Pohang University of Science and Technology, Korea

Seong-Jin Kim
Ulsan National Institute of Science and Technology, Korea

Taeik Kim
Samsung Electronics, Gyeonggi-do, Korea

Nagendra Krishnapura
Indian Institute of Technology Madras, Chennai, India

Man-Kay Law
University of Macau, Macau, China

Dong Uk Lee
SK hynix, Gyeonggi-do, Korea

Jongwoo Lee
Samsung Electronics, Hwasung-si Gyunggi-do, Korea

Surk Hwan Lim
Samsung, Korea

Howard C. Luong
Hong Kong University of Science and Technology, Kowloon, Hong Kong

Yan Lu
University of Macau, Taipa, Macau

Hideaki Majima
Toshiba, Kawasaki, Japan

Masayuki Miyamoto
Wacom, Tokyo, Japan

Masato Motomura
Hokkaido University, Sapporo, Japan

Subhashish Mukherjee
Texas Instruments, Bangalore, India

Makoto Nagata
Kobe University, Kobe, Japan

Munehiko Nagatani
NTT Corporation, Kanagawa, Japan

Kazuko Nishimura
Panasonic Corporation, Moriguchi, Japan

Mijung Noh
Samsung Electronics, Gyeonggi-do, Korea

Kohei Onizuka
Toshiba, Kawasaki, Japan

Takashi Oshima
Hitachi, Tokyo,Japan

Jongmin Park
SK Hynix, Gyeonggi-di, Korea

Ki-Tae Park
Samsung, Hwaseong, Korea

Jiseon Paek
Samsung, S. Chungchung Province, Korea

Bor-Doou Rong
Etron

Jiayoon Ru
XINYI Information Technology

Hirofumi Shinohara
Waseda University, Fukuoka, Japan

Shinichiro Shiratake
Kioxia, Yokohama, Japan

Yasuhiko Taito
Renesas, Tokyo, Japan

Takashi Takemoto
Hokkaido University, Hokkaido, Japan

Chen-Kong Teh
Toshiba Semiconductor, Kawasaki, Japan

Hayato Wakabayashi
Sony Semiconductor Solutions Corporation, Kanagawa, Japan

Wen-Chieh Wang
MediaTek, Hsinchu City, Taiwan

Jerald Yoo
National University of Singapore, Singapore

Yuu Watanabe
Waseda University, Kanagawa, Japan

Ken Yamamoto
Sony, Kanagawa, Japan

Xiaoyang Zeng
Fudan University, Shanghai, China

Conan Zhan
MediaTek, HsinChu, Taiwan