CICC

ISSCC Committees

2021 Executive & Regional Committees

Conference Chair

Kevin Zhang
Taiwan Semiconductor Manufacturing Company, Hsinchu, Taiwan

Past Conference Chair

Jan van der Spiegel
University of Pennsylvania, Philadelphia, PA

Senior Technical Advisor

Anantha Chandrakasan
Massachusetts Institute of Technology, Cambridge, MA

Executive Committee Secretary, Demo Session Chair

Eugenio Cantatore
Eindhoven University of Technology, Eindhoven, The Netherlands

Press Coordinator

Shahriar Mirabbasi
University of British Columbia, Vancouver, Canada

Executive Committee Secretary, Data Team, SRP Chair, Press Coordinator

Denis Daly
Apple, Wellesley, MA

Web Site & A/V Chair

Trudy Stetzler
Halliburton, Houston, TX

Director of Finance

John Weinmann
Rochester, NY

Program Chair

Makoto Ikeda
University of Tokyo, Tokyo, Japan
Oregon State University, Corvallis, OR

Program Vice-Chair

Edith Beigné
Facebook. Menlo Park, CA

WIC,  Industry Showcase Representative

Alice Wang
Everactive, Santa Clara, CA

Industry Showcase Representative

Dennis Sylvester
University of Michigan, Ann Arbor, MI

ITPC Far East Regional Chair

Long Yan
Samsung Electronics, Hwaseong-si, Korea

ITPC Far East Regional Vice-Chair

Yun-Shiang Shu
MediaTek, Hsinchu City, Taiwan

ITPC European Regional Chair

Tim Piessens
ICsense, Leuven, Belgium

ITPC European Regional Vice-Chair

Bruce Rae
ST Microelectronics, Edinburgh, United Kingdom

Adcom Representative

Bryan Ackland
Old Bridge, NJ

Director of Publications

Laura Fujino
University of Toronto, Toronto, Canada

Press Liaison & ARC Chair

Kenneth C. Smith
University of Toronto, Toronto, Canada

Forums Chair

David Robertson
Analog Devices, Wilmington, MA

Education Chair (Short Course – Tutorials)

Ali Sheikholeslami
University of Toronto, Toronto, Canada

Director of Operations

Melissa Widerkehr
Widerkehr and Associates, Montgomery Village, MD

European Regional Subcommittee

ITPC European Regional Chair

Tim Piessens
ICsense, Leuven, Belgium

ITPC European Regional Vice-Chair

Bruce Rae
ST Microelectronics, Edinburgh, United Kingdom

ITPC European Regional Secretary

Bernhard Wicht
University of Hannover, Hannover, Germany

Jens Anders
University of Stuttgart, Stuttgart, Germany

Matteo Bassi
Infineon Technologies AG, Villach, AustriaLuca Benini
ETHZ and UNIBO, Zürich, Switzerland

Luca Benini
ETHZ and UNIBO, Zurich, Switzerland

Marco Berkhout
Goodix

Andrea Bevilacqua
University of Padova, Padova, Italy

Edoardo Charbon
EPFL, Neuchâtel, Switzerland

Jan Craninckx
IMEC, Leuven, Belgium

Shidhartha Das
Arm, Cambridge, United Kingdom

Theodoros Georgantas
Broadcom, Athens, Greece

Friedel Gerfers
Technische Universität Berlin, Berlin, Germany

Frederic Gianesello
STMicroelectronics, Crolles, France

Johan Janssens
ON Semiconductor, Belgium

Salvatore Levantino
Politecnico di Milano (POLIMI), Milan, Italy

Yao-Hong Liu
imec, Eindhoven, The Netherlands

Kofi Makinwa
Delft University of Technology, Delft, The Netherlands

Dominique Morche
Département Architecture Conception et Logiciel Embarqué (DACLE), Grenoble Cedex, France

Violante Moschiano
Micron, Avezzano (AQ), Italy

Matteo Perenzoni
Fondazione Bruno Kessler (FBK), Povo, Italy

Gael Pillonnet
CEA-Léti, Grenoble, France

Patrick Reynaert
KU Leuven, Leuven, Belgium

Esther Rodriguez-Villegas
Imperial College London, London, United Kingdom

Viola Schafer
Texas Instruments, Freising, Germany

Yvain Thonnart
CEA-Leti, Grenoble, France

Thomas Toifl
Cisco Systems, Wallisellen. Switzerland

Nick Van Helleputte
imec, Leuven, Belgium

Chris Van Hoof
imec, Leuven, Belgium

Ingrid Verbauwhede
KU Leuven, Leuven, Belgium

Bob Verbruggen
Xilinx, Dublin, Ireland

Marian Verhelst
KU Leuven, Heverlee, Belgium

Gerard Villar-Pique
NXP Semiconductor, Brabant, The Netherlands

Jan Westra
Broadcom, Bunnik, The Netherlands

Far East Regional Subcommittee

ITPC Far East Regional Chair

Long Yan
Samsung Electronics, Hwaseong-si, Korea

ITPC Far East Regional Vice-Chair

Yun-Shiang Shu
Mediatek, Hsinchu City, Taiwan

ITPC Far East Regional Secretary

Jun Deguchi
Kioxia Corporation, Kawasaki, Japan

ITPC Far East Associate Secretary

Man-Kay Law
University of Macau, Macau, China

Massimo Alioto
National University of Singapore, Singapore

Shuhei Amakawa
Hiroshima University, Japan

Joonsung Bae
Kangwon National University, Kangwon-do, Korea

Seung-Jun Bae
Samsung, Hwasung, Korea

Youngcheol Chae
Yonsei University, Seoul, Korea

Hsie-Chia Chang
National Chiao Tung University, HsinChu, Taiwan

Jonathan Chang
TSMC, Hsinchu, Taiwan

Meng-Fang Chang
National Tsing-Hua University, Hsinchu, Taiwan

Calvin Yi-Ping Chao
TSMC, Hsinchu, Taiwan

Ke-Horng Chen
National Chiao Tung University, Hsinchu, Taiwan

Wei-Zen Chen
National Chiao Tung University (NCTU), Hsin-Chu, Taiwan

Chan-Hong Chern
TSMC, Hsinchu, Taiwan

Jaehyouk Choi
KAIST, Yuseong-gu Daejeon, Korea

Yuan-Hung Chung
MediaTek, Hsinchu, Taiwan

Wei Deng
Tsinghua University, Beijing, China

Li Geng
Xi’an Jiaotong University, Shaanxi, China

Koji Hirairi
Sony LSI Design, Kanagawa, Japan

Chih-Cheng Hsieh
National Tsing Hua University, Hsinchu, Taiwan

Ping-Hsuan Hsieh
National Tsing Hua University, Hsinchu City, Taiwan

Kuo-Chun Hsu
MediaTek, HsinChu, Taiwan

Shawn Shuo-Hung Hsu
National Tsing Hua University, Hsinchu, Taiwan

Ru Huang
Peking University, Beijing, China

Junho Huh
Samsung, Gyeonggi-do, Korea

Hiroyuki Ito
Tokyo Institute of Technology, Yokohama, Japan

Byungsub Kim
Pohang University of Science and Technology, Korea

Seong-Jin Kim
Ulsan National Institute of Science and Technology, Korea

Taeik Kim
Samsung Electronics, Gyeonggi-do, Korea

Nagendra Krishnapura
Indian Institute of Technology Madras, Chennai, India

Dong Uk Lee
SK hynix, Gyeonggi-do, Korea

Jongwoo Lee
Samsung Electronics, Hwasung-si Gyunggi-do, Korea

Jri Lee
National Taiwan University, Taipei, Taiwan

Junghyup Lee
DGIST, Daegu, Korea

Seung-Jae Lee
Samsung, Gyeonggi-do, Korea

SurkHwan Lim
Samsung, Korea

Yongpan Liu
Tsinghua University, Beijing, China

Yan Lu
University of Macau, Taipa, Macao

Byung-Wook Min
Yonsei University, Seoul, Korea

Toshiya Mitomo
Toshiba, Kanagawa, Japan

Kosuke Miyaji
Shinshu University, Nagano, Japan

Masayuki Miyamoto
Wacom, Tokyo, Japan

Masato Motomura
Tokyo Institute of Technology, Yokohama, Japan

Makoto Nagata
Kobe University, Kobe, Japan

Munehiko Nagatani
NTT Corporation, Kanagawa, Japan

Kazuko Nishimura
Panasonic Corporation, Moriguchi, Japan

Mijung Noh
Samsung Electronics, Gyeonggi-do, Korea

Takashi Oshima
Hitachi, Tokyo,Japan

Jiseon Paek
Samsung Electronics, S. Chungchung Province, Korea

Bor-Doou Rong
Etron, Hsinchu, Taiwan

Hirofumi Shinohara
Waseda University, Fukuoka, Japan

Shinichiro Shiratake
Kioxia, Yokohama, Japan

Yasuhiko Taito
Renesas, Tokyo, Japan

Takashi Takemoto
Hokkaido University, Hokkaido, Japan

Chen-Kong Teh
Toshiba Semiconductor, Kawasaki, Japan

Hayato Wakabayashi
Sony Semiconductor Solutions Corporation, Kanagawa, Japan

Wen-Chieh Wang
MediaTek, Hsinchu City, Taiwan

Hongtao Xu
Fudan University, Shanghai, China

Jiawei Xu
Fudan University, Shanghai, China

Jerald Yoo
National University of Singapore, Singapore

C. Patrick Yue
Hong Kong University of Science and Technology, Clear Water Bay, Hong Kong

Conan Zhan
MediaTek, HsinChu, Taiwan

Milin Zhang
Tsinghua University, Beijing, China