Technical Editors
Jason H. Anderson
University of Toronto, Toronto, Canada
Leonid Belostotski
The University of Calgary, Calgary, Canada
Dustin Dunwell
Huawei Technologies, Markham, Canada
Vincent Gaudet
University of Waterloo,Waterloo, Canada
Glenn Gulak
University of Toronto, Toronto, Canada
James W. Haslett
The University of Calgary, Calgary, Canada
Dave Halupka
Kapik Integration, Toronto, Canada
Kenneth C. Smith
University of Toronto, Toronto, Canada
Multi-Media Coordinator
Dave Halupka
Kapik Integration, Toronto, Canada
Program Chair
Alison Burdett
Sensium Healthcare, Oxfordshire, United Kingdom
Program Vice-Chair
Eugenio Cantatore
Eindhoven University of Technology, Eindhoven, The Netherlands
Forum Committee
Chair: Andreia Cathelin
STMicroelectronics, Crolles Cedex, France
Vice-Chair: David Robertson
Analog Devices, Wilmington, MA
Sonia Leon
Intel Mobile Communications, Santa Clara, CA
William Redman-White
Southampton University, Hampshire, United Kingdom
Franz Dielacher
Infineon Technologies Santa Clara, CA
Sven Mattisson
Ericsson AB, Lund, Sweden
Stefan Rusu
TSMC, Sunnyvale, CA
Albert Theuwissen
Harvest Imaging, Bree, Belgium
Atsuki Inoue
Fujitsu, Kawasaki, Japan
Bryan Ackland
Stevens Institute of Tech., Hoboken, NJ
EU Representative: Kostas Doris
NXP, Eindhoven, The Netherlands
FE Representative: Tai-Cheng Lee
National Taiwan University, Taipei, Taiwan
Analog Subcommittee
Chair: Kofi Makinwa
Delft University of Technology, Delft, The Netherlands
David Blaauw
University of Michigan, Ann Arbor, MI
Youngcheol Chae
Yonsei University, Seoul, Korea
Vadim Ivanov
Texas Instruments, Tucson, AZ
Mahdi Kashmiri
Robert Bosch Research and Technology Center, Palo Alto, CA
Taeik Kim
Samsung Electronics, Gyeonggi-do, Korea
Tai-Haur Kuo
National Cheng Kung University, Tainan, Taiwan
Man-Kay Law
University of Macau, Macau, China
Yiannos Manoli
University of Freiburg – IMTEK, Freiburg, Germany
Tim Piessens
ICsense, Leuven, Belgium
Yong Ping Xu
National University of Singapore, Singapore
Young-Sub Yuk
SK Hynix, Icheon, Korea
Data Converters Subcommittee
Chair: Un-Ku Moon
Oregon State University, Corvallis, OR
Kostas Doris
NXP, Eindhoven, The Netherlands
Paul Ferguson
Analog Devices, Wilmington, MA
Michael Flynn
University of Michigan, Ann Arbor, MI
Pieter Harpe
Eindhoven University of Technology, Eindhoven, The Netherlands
Stéphane Le Tual
STmicroelectronics, Crolles, France
Tai-Cheng Lee
National Taiwan University, Taipei, Taiwan
Takashi Oshima
Hitachi, Tokyo,Japan
Seung-Tak Ryu
KAIST, Daejeon, Korea
Yun-Shiang Shu
Mediatek, Hsinchu City, Taiwan
Venkatesh Srinivasan
Texas Instruments, Dallas, TX
Matt Straayer
Maxim Integrated Products, North Chelmsford, MA
Seng-Pan (Ben) U
University of Macau, Macau
Bob Verbruggen
Xilinx, Dublin, Ireland
Jan Westra
Broadcom, Bunnik, The Netherlands
Digital Architectures & Systems (DAS) Subcommittee
Chair: Byeong-Gyu Nam
Chungnam National University, Daejeon, Korea
Thomas Burd
Advanced Micro Devices, Sunnyvale, CA
Hsie-Chia Chang
National Chiao Tung University, HsinChu, Taiwan
Christopher Gonzalez
IBM, Yorktown Heights, NY
Wookyeong Jeong
Samsung, Hwaseong, Korea
Muhammad Khellah
Intel, Hillsboro, OR
Dejan Markovic
UCLA, Los Angeles, CA
Mahesh Mehendale
Texas Instruments, Bangalore, India
Masato Motomura
Hokkaido University, Sapporo, Japan
James Myers
ARM, Cambridgeshire, United Kingdom
Marian Verhelst
KU Leuven, Heverlee, Belgium
Digital Circuits (DCT) Subcommittee
Chair: Edith Beigné
CEA-LETI, Grenoble, France
Keith Bowman
Qualcomm, Raleigh, NC
Vivek De
Intel, Hillsboro, OR
Wim Dehaene
Kuleuven-MICAS, Leuven, Belgium
Koji Hirairi
Sony LSI Design, Kanagawa, Japan
John Maneatis
True Circuits, Los Altos, CA
Phillip Restle
IBM T. J. Watson Research Center, Yorktown Heights, NY
Youngmin Shin
Samsung, Gyeonggi-Do, Korea
Hirofumi Shinohara
Waseda University, Fukuoka, Japam
Dennis Sylvester
University of Michigan, Ann Arbor, MI
Ping-Ying Wang
CMOS-Crystal, Hsinchu City, Taiwan
Kathy Wilcox
AMD, Boxborough, MA
IMMD Subcommittee
Chair: Makoto Ikeda
University of Tokyo, Tokyo,Japan
Gert Cauwenberghs
University of California, San Diego, La Jolla, CA
Calvin Yi-Ping Chao
TSMC, Hsinchu, Taiwan
Yoon-Kyung Choi
Samsung, Hwaseong, Korea
Peng Cong
Alphabet Inc., Mountain View, CA
Jun Deguchi
Toshiba, Kawasaki,Japan
Keith Fife
4Catalyzer, Guilford, CT
Michael Kraft
Montefiore Institute University of Liege, Liege, Belgium
Pedram Lajevardi
Robert Bosch LLC, Palo Alto, CA
Masayuki Miyamoto
Wacom, Tokyo, Japan
Pedram Mohseni
Case Western Reserve University, Cleveland, OH
Matteo Perenzoni
Fondazione Bruno Kessler Center, Povo, Italy
Esther Rodriguez-Villegas
Imperial College London, London, United Kingdom
Joseph Shor
Bar Ilan University, Ramat Gan, Isreal
Nick Van Helleputte
imec, Leuven, Belgium
Hayato Wakabayashi
Sony Electronics, San Jose, CA
Peter Chung-Yu Wu
National Chiao Tung University, Hsinchu, Taiwan